XC7Z035-3FBG676E Allicdata Electronics
Allicdata Part #:

XC7Z035-3FBG676E-ND

Manufacturer Part#:

XC7Z035-3FBG676E

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Xilinx Inc.
Short Description: IC SOC CORTEX-A9 KINTEX7 676BGA
More Detail: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Syste...
DataSheet: XC7Z035-3FBG676E datasheetXC7Z035-3FBG676E Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: Zynq®-7000
Packaging: Tray 
Part Status: Active
Architecture: MCU, FPGA
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size: --
RAM Size: 256KB
Peripherals: DMA
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 800MHz
Primary Attributes: Kintex™-7 FPGA, 275K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)
Number of I/O: 130
Description

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System-on-Chip (SoC) is an embedded system which integrates all or most components (both hardware and software) of a computer or other electronic system on a single integrated circuit. Xilinx\'s Virtex-7 family FPGAs with Zynq-7000 All Programmable SoC have a wide range of applications. This article will discuss the application field and working principle of XC7Z035-3FBG676E.

XC7Z035-3FBG676E is a low-cost FPGA enhanced with ARM processors for high performance applications. It is based on the 28nm Xilinx 7 series advanced node and provides an enhanced design solution with the Virtex-7 FPGA, an embedded Tri-Mode Gigabit Ethernet MAC, and high-speed connectivity. The 3FBG676E device offers 875k logic elements, 5720K bits of RAM and up to 3976 user I/O. With the combination of powerful Zynq ARM Cortex-A9 processors, high-speed transceivers, and a DDR3 memory interface, the XC7Z035-3FBG676E provides a high performance, cost-effective solution for a wide range of applications.

XC7Z035-3FBG676E has a wide range of applications ranging from high-performance embedded systems to imaging and vision, signal processing, software-defined radio, and digital power applications. With its advanced features, it can be used in medical imaging, digital imaging, automotive, robotics, data centers, and many other embedded applications with stringent requirements. It also provides opportunities to develop sophisticated, intelligent and interactive systems.

In terms of working principle, the XC7Z035-3FBG676E combines an FPGA and an ARM Cortex-A9 processor in one device. The FPGA is made up of programmable logic blocks, which can be configured to carry out any number of desired functions. With the on-board ARM Cortex-A9 processor, the device can execute computationally intensive tasks such as mathematical operations, logic operations, and other intensive computations. The processor also features a memory interface allowing for high-speed data exchange between the FPGA circuit and external memory devices. The device also features multiple high-speed serial transceivers, which enable high-speed connectivity with other units outside the device. Overall, the XC7Z035-3FBG676E provides a powerful and cost-effective solution for a wide range of embedded applications.

In conclusion, the XC7Z035-3FBG676E is a versatile and powerful embedded SoC for a wide range of applications. It offers an integrated solution for high performance embedded systems as well as imaging, signal processing, and digital power applications. With its advanced features, it is ideal for developing sophisticated, intelligent and interactive systems. With its FPGA, ARM Cortex-A9 processor, memory interface, and multiple high-speed transceivers, the XC7Z035-3FBG676E provides a powerful and cost-effective solution for embedded designs.

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