| Allicdata Part #: | XC7Z035-1FFG900I-ND |
| Manufacturer Part#: |
XC7Z035-1FFG900I |
| Price: | $ 0.00 |
| Product Category: | Integrated Circuits (ICs) |
| Manufacturer: | Xilinx Inc. |
| Short Description: | IC SOC CORTEX-A9 KINTEX7 900BGA |
| More Detail: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Syste... |
| DataSheet: |  XC7Z035-1FFG900I Datasheet/PDF |
| Quantity: | 1000 |
| Flash Size: | -- |
| RAM Size: | 256KB |
| Peripherals: | DMA |
| Connectivity: | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Speed: | 667MHz |
| Primary Attributes: | Kintex™-7 FPGA, 275K Logic Cells |
| Operating Temperature: | -40°C ~ 100°C (TJ) |
| Package / Case: | 900-BBGA, FCBGA |
| Supplier Device Package: | 900-FCBGA (31x31) |
| Number of I/O: | 130 |
| Series: | Zynq®-7000 |
| Packaging: | Tray |
| Part Status: | Active |
| Architecture: | MCU, FPGA |
| Core Processor: | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
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Xilinx\'s Zynq-7000 family of all-programmable SoCs combines an FPGA with dual-core ARM Cortex-A9 processors. The main features of the Xilinx Zynq-7000 family is that it integrates all components of a high-performance system into a single chip, thereby reducing power consumption and development time. The Xilinx XC7Z035-1FFG900I is a class of SoC specifically designed for embedded applications.
The XC7Z035-1FFG900I is a reliable SoC solution for general purpose, low power, low cost embedded applications. Specifically, it features a 28nm high-performance Zynq-7000 SoC platform. This platform consists of a dual-core ARM Cortex-A9 processor, with MMU, tightly coupled with an FPGA fabric. This combination of processor cores and FPGA fabric provides the embedded designer powerful access to high performance, flexibility, and throughput with lower power consumption.
The configureable I/Os on the XC7Z035-1FFG900I is a rich set of peripherals and interfaces, ranging from Ethernet and high-speed serial Interfaces, to CAN, CANopen, and Multiport memories. These I/Os are configurable, allowing designers to choose the right I/O for their specific application. For example, for a communication application, the designer can configure the XC7Z035-1FFG900I\'s I/Os to support Ethernet, USB, SPI, I2C Interfaces, and more.
One of the most important features of the XC7Z035-1FFG900I is its enhanced power management. This SoC solution offers a complete platform for energy efficiency, allowing designers to configure and utilize the various power management features for optimal power consumption. For example, the CoreSight-compatible SoC level power management enables users to adjust the power states of each power domain to reduce power consumption. The power manager also supports dynamic frequency scaling and on-the-fly clock and voltage scaling to minimize power consumption during system activity.
The XC7Z035-1FFG900I\'s real-time performance is also improved with its Advanced Microcontroller Bus Architecture (AMBA) technology. AMBA is a set of on-chip peripherals and interfaces, which are well-suited for embedded system designs. This technology allows users to create high-speed buses that transmit data between the embedded cores and peripherals with minimal latency. Furthermore, the AMBA system also supports real-time debugging capabilities, allowing developers to monitor the embedded system performance and quickly identify errors in their design.
The XC7Z035-1FFG900I is designed for a wide range of applications, such as consumer electronics, medical, military and industrial embedded systems. Its power and performance features make it an ideal choice for embedded designs. In addition, its support for embedded development tools and AMBA technology make it the perfect platform for developing embedded applications.
The specific data is subject to PDF, and the above content is for reference
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