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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
S912XHY128F0CLL R-ND	S912XHY128F0CLL R	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 76 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 8K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	1000+: $3.2659
MC9S12XF512MLM- ND	MC9S12XF512MLM	NXP USA Inc	View more Series: HCS12X Packaging: Tray Part Status: Not For New Designs Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 88 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20) Base Part Number: MC9S12XF512	180 Order	1+: $164.17
568-11652-2-ND	NX5P2190UKZ	NXP USA Inc	View more Series: NX5 Packaging: Tape & Reel (TR) Part Status: Active Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: On/Off Voltage - Load: 3 V ~ 5.5 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 2A Rds On (Typ): 60 mOhm Input Type: Non-Inverting Features: Slew Rate Controlled Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Reverse Current, UVLO Operating Temperature: -40C ~ 85C (TA) Package / Case: 9-UFBGA, WLCSP Supplier Device Package: 9-WLCSP (1.36x1.36)	1000 Order	5000+: $0.2378
LPC1763FBD100K- ND	LPC1763FBD100K	NXP USA Inc	View more Series: LPC17xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 100MHz Connectivity: IC, IrDA, Microwire, SPI, SSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, IS, Motor Control PWM, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	450+: $3.318
S9S12HY64J0CLL- ND	S9S12HY64J0CLL	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: S9S12HY64	1000 Order	--
MC9S12XHZ256CAG -ND	MC9S12XHZ256CAG	NXP USA Inc	View more Series: HCS12X Packaging: Tray Part Status: Not For New Designs Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, IC, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 117 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: MC9S12XHZ256	1000 Order	300+: $9.0326
568-12898-2-ND	NX5P3201CUKZ	NXP USA Inc	View more Series: NX5 Packaging: Tape & Reel (TR) Part Status: Obsolete Switch Type: USB Switch Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: Parallel Voltage - Load: 2.7 V ~ 5.5 V, 3.4 V ~ 5.5 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 3A, 6A Rds On (Typ): 8 mOhm, 32 mOhm Input Type: Non-Inverting Features: Slew Rate Controlled, Status Flag Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO Operating Temperature: -40C ~ 85C (TA) Package / Case: 30-UFBGA, WLCSP Supplier Device Package: 30-WLCSP (2.26x2.56)	1000 Order	1+: $0
S912ZVCA96F0MLF -ND	S912ZVCA96F0MLF	NXP USA Inc	View more Series: S12 MagniV Packaging: Tray Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 10x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	1000 Order	1250+: $2.2708
MC22XS4200BEKR2 -ND	MC22XS4200BEKR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:2 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 8 V ~ 36 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 3A Features: Slew Rate Controlled Fault Protection: Open Load Detect, Over Temperature Operating Temperature: -40C ~ 125C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Base Part Number: MC22XS4200	1000 Order	1000+: $2.7918
MK10DN512VLK10- ND	MK10DN512VLK10	NXP USA Inc	View more Series: Kinetis K10 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SD, SPI, UART/USART Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 31x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: MK10DN512	480 Order	1+: $49.25
568-14596-ND	MC07XSC200EK	NXP USA Inc	View more Packaging: Tube Part Status: Last Time Buy Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 26A Rds On (Typ): 7 mOhm (Max) Features: Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Operating Temperature: -40C ~ 125C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Base Part Number: MC07XSC200	1000 Order	1+: $3.7296 10+: $3.3466 100+: $2.7421 500+: $2.3343 1000+: $1.9687
568-4792-ND	LPC1758FBD80,55 1	NXP USA Inc	View more Series: LPC17xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, Ethernet, IC, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, IS, Motor Control PWM, POR, PWM, WDT Number of I/O: 52 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 6x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: LPC1758	2902 Order	1+: $6.6906 10+: $6.0449 100+: $5.0048 500+: $4.3581 1000+: $3.7958
MC908MR32CFUE-N D	MC908MR32CFUE	NXP USA Inc	View more Series: HC08 Packaging: Tray Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Controller Series: Microcontrollers - MCU Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Interface: SCI, SPI Number of I/O: 44 Program Memory Size: 32KB (32K x 8) Voltage - Supply: 4.5 V ~ 5.5 V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14) Base Part Number: MC908MR32	5229 Order	--
MKL26Z64VLH4-ND	MKL26Z64VLH4	NXP USA Inc	View more Series: Kinetis KL2 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: IC, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, IS, LVD, POR, PWM, WDT Number of I/O: 50 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D - 16bit, D/A - 12bit Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: MKL26Z64	20 Order	1+: $49.25
568-14500-ND	LPC4327JBD144E	NXP USA Inc	View more Series: LPC43xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, IS, Motor Control PWM, POR, PWM, WDT Number of I/O: 83 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: LPC4327	60 Order	1+: $8.7507 10+: $8.0432 100+: $6.793 500+: $6.0428 1000+: $5.5427
S912XHY256F0VLM R-ND	S912XHY256F0VLM R	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 88 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 8K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	1000 Order	500+: $4.5505
S9S12HY32J0VLL- ND	S9S12HY32J0VLL	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	450+: $3.213
568-4790-ND	LPC1754FBD80,55 1	NXP USA Inc	View more Series: LPC17xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 100MHz Connectivity: CANbus, IC, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT Number of I/O: 52 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 6x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: LPC1754	221 Order	1+: $5.1975 10+: $4.6935 100+: $3.8857 500+: $3.3836 1000+: $2.947
S9S12HY64J0MLH- ND	S9S12HY64J0MLH	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 50 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: S9S12HY64	1000 Order	800+: $3.2322
SP5742PFK1AMLQ9 R-ND	SP5742PFK1AMLQ9 R	NXP USA Inc	View more Series: MPC57xx Packaging: Tape & Reel (TR) Part Status: Active Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	2000 Order	1+: $131.34
MC07XSC200EKR2- ND	MC07XSC200EKR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Last Time Buy Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 26A Rds On (Typ): 7 mOhm (Max) Features: Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Operating Temperature: -40C ~ 125C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Base Part Number: MC07XSC200	1000 Order	1000+: $1.9687
MC15XS3400CHFKR 2-ND	MC15XS3400CHFKR 2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 6A Rds On (Typ): 15 mOhm Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40C ~ 150C (TJ) Package / Case: 24-PowerQFN Supplier Device Package: 24-PQFN (12x12) Base Part Number: MC15XS3400	1000 Order	1200+: $2.4482
MC33HB2001EKR2- ND	MC33HB2001EKR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Output Configuration: Half Bridge (2) Applications: DC Motors, General Purpose Interface: SPI Load Type: Inductive Technology: Power MOSFET Rds On (Typ): 125 mOhm LS (Max), 125 mOhm HS (Max) Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40C ~ 150C (TJ) Features: Slew Rate Controlled Fault Protection: Over Temperature, Over Voltage, UVLO Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	1000 Order	1000+: $2.3966
S912XHY256F0MLL -ND	S912XHY256F0MLL	NXP USA Inc	View more Series: HCS12X Packaging: Tray Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 76 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 8K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	450+: $4.9802
MC17XS6400BEKR2 -ND	MC17XS6400BEKR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 7 V ~ 18 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 5.5A Rds On (Typ): 17 mOhm Features: Slew Rate Controlled Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature Operating Temperature: -40C ~ 125C (TA) Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	1000 Order	1000+: $2.4997
LPC4353JET256,5 51-ND	LPC4353JET256,5 51	NXP USA Inc	View more Series: LPC43xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4/M0 Core Size: 32-Bit Dual-Core Speed: 204MHz Connectivity: CANbus, EBI/EMI, Ethernet, IC, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, IS, LCD, Motor Control PWM, POR, PWM, WDT Number of I/O: 164 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 136K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-LBGA (17x17) Base Part Number: LPC4353	1000 Order	90+: $8.1387
MC9S08AW60CPUE- ND	MC9S08AW60CPUE	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: MC9S08AW60	250 Order	1+: $36.94
S9S12HA32J0VLL- ND	S9S12HA32J0VLL	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	--
568-4968-ND	LPC1759FBD80,55 1	NXP USA Inc	View more Series: LPC17xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, IC, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, IS, Motor Control PWM, POR, PWM, WDT Number of I/O: 52 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 6x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (12x12) Base Part Number: LPC1759	1972 Order	1+: $6.6906 10+: $6.0449 100+: $5.0048 500+: $4.3581 1000+: $3.7958
S9S12ZVL32F0MLF -ND	S9S12ZVL32F0MLF	NXP USA Inc	View more Series: S12 MagniV Packaging: Tray Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: IC, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Interface: I2C, SCI, SPI Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: S9S12ZVL32F0MLF	957 Order	1+: $24.62
MC9S08SH8CTGRTR -ND	MC9S08SH8CTGR	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: I2C, SCI, SPI Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Voltage - Supply: 2.7V ~ 5.5V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP Base Part Number: MC9S08SH8	22511 Order	--
568-14257-ND	S9S12HA48J0CLL	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: 9S12HA48	450 Order	--
568-7564-ND	TFA9879HN/N1,15 7	NXP USA Inc	View more Packaging: Tray Lead Free Status / RoHS Status: Lead free / RoHS Compliant Part Status: Active Moisture Sensitivity Level (MSL): 1 (Unlimited) Type: Class D Output Type: 1-Channel (Mono) Max Output Power x Channels @ Load: 2.75W x 1 @ 4 Ohm Voltage - Supply: 2.5 V ~ 5.5 V Features: Depop, Digital Inputs, IC, IS, Mute, Short-Circuit and Thermal Protection, Tone and Volume Control Mounting Type: Surface Mount Operating Temperature: -20C ~ 85C (TA) Supplier Device Package: 24-HVQFN (4x4) Package / Case: 24-VFQFN Exposed Pad Base Part Number: TFA9879	5081 Order	1+: $1.4931 10+: $1.3388 100+: $1.0759 500+: $0.8839 1000+: $0.7324
MC56F8037VLH-ND	MC56F8037VLH	NXP USA Inc	View more Series: 56F8xxx Packaging: Tray Part Status: Active Core Processor: 56800E Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: POR, PWM, WDT Interface: CAN, I2C, LIN Number of I/O: 53 Program Memory Size: 64KB (32K x 16) Voltage - Supply: 3V ~ 3.6V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 4K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 16x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: MC56F8037	4230 Order	--
568-9599-ND	LPC1317FHN33,55 1	NXP USA Inc	View more Series: LPC13xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Connectivity: IC, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 26 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 10K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7) Base Part Number: LPC1317	1300 Order	1+: $49.25
MKE02Z16VLD4-ND	MKE02Z16VLD4	NXP USA Inc	View more Series: Kinetis KE02 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0+ Core Size: 32-Bit Speed: 40MHz Connectivity: IC, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 37 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	1000 Order	--
568-14168-ND	S9S12ZVL32F0VLF	NXP USA Inc	View more Series: S12 MagniV Packaging: Tray Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: IC, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	1483 Order	1+: $60.74
568-14583-ND	MC10XS3425EK	NXP USA Inc	View more Packaging: Tube Part Status: Active Switch Type: General Purpose Number of Outputs: 4 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 6 V ~ 20 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 6A Rds On (Typ): 10 mOhm, 25 mOhm Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, UVLO Operating Temperature: -40C ~ 150C (TJ) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Base Part Number: MC10XS3425	1000 Order	--
MC06XS4200BFKR2 -ND	MC06XS4200BFKR2	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 8 V ~ 36 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 9A Rds On (Typ): 6 mOhm (Max) Features: Internal PWM, Slew Rate Controlled Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40C ~ 125C (TA) Package / Case: 23-PowerQFN Supplier Device Package: 23-PQFN (12x12)	1000 Order	1200+: $4.426
LPC1763FBD100Y- ND	LPC1763FBD100Y	NXP USA Inc	View more Series: LPC17xx Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 100MHz Connectivity: IC, IrDA, Microwire, SPI, SSI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, IS, Motor Control PWM, POR, PWM, WDT Number of I/O: 70 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: A/D 8x12b, D/A 1x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	1000+: $2.6349

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