Nxp timing buffer - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
568-4184-2-ND	TDA1308AUK,027	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Class AB Output Type: Headphones, 2-Channel (Stereo) Max Output Power x Channels @ Load: 80mW x 2 @ 32 Ohm Voltage - Supply: 2.4 V ~ 7 V, 1.2 V ~ 3.5 V Features: Depop, Short-Circuit Protection Mounting Type: Surface Mount Operating Temperature: -40C ~ 85C (TA) Supplier Device Package: 8-WLCSP Package / Case: 8-XFBGA, WLCSP Base Part Number: TDA1308	1000 Order	1+: $0
TDA1519CTD/N3,1 18-ND	TDA1519CTD/N3,1 18	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Class B Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 22W x 1 @ 4 Ohm; 11W x 2 @ 2 Ohm Voltage - Supply: 6 V ~ 17.5 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -25C ~ 150C (TJ) Supplier Device Package: 20-HSOP Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Base Part Number: TDA1519	1000 Order	1+: $0
TDA8571J/N2C,11 2-ND	TDA8571J/N2C,11 2	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Type: Class B Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 45W x 4 @ 4 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40C ~ 85C (TA) Supplier Device Package: DBS23P Package / Case: 23-SIP Formed Leads Base Part Number: TDA8571J	1000 Order	1+: $0
568-1191-5-ND	ICM7555CN,602	NXP USA Inc	View more Packaging: Tube Part Status: Obsolete Type: 555 Type, Timer/Oscillator (Single) Frequency: 500kHz Voltage - Supply: 3 V ~ 16 V Current - Supply: 180A Operating Temperature: 0C ~ 70C Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP Mounting Type: Through Hole Base Part Number: ICM7555	1000 Order	1+: $0
MPC9230FA-ND	MPC9230FA	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Type: Clock/Frequency Synthesizer, Clock Generator, Multiplexer PLL: Yes with Bypass Input: Crystal Output: LVPECL Number of Circuits: 1 Ratio - Input:Output: 1:1 Differential - Input:Output: No/Yes Frequency - Max: 750MHz Divider/Multiplier: Yes/No Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: -40C ~ 85C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7) Base Part Number: MPC9230	1000 Order	1+: $0
568-10657-2-ND	PEMI4QFN/WP,132	NXP USA Inc	View more Series: PEMIxQFN Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Low Pass Filter Order: 2nd Technology: RC (Pi) Number of Channels: 4 Attenuation Value: 30dB @ 800MHz ~ 3GHz Resistance - Channel (Ohms): 200 Values: R = 200 Ohms, C = 18.5pF (Total) ESD Protection: Yes Operating Temperature: -40C ~ 85C Applications: LAN, PCS, WAN Mounting Type: Surface Mount Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Height: 0.020" (0.50mm)	1000 Order	1+: $0
568-10724-2-ND	PEMI8QFN/WM,132	NXP USA Inc	View more Series: PEMIxQFN Packaging: Tape & Reel (TR) Part Status: Obsolete Type: Low Pass Filter Order: 2nd Technology: RC (Pi) Number of Channels: 8 Attenuation Value: 27dB @ 800MHz ~ 3GHz Resistance - Channel (Ohms): 200 Values: R = 200 Ohms, C = 16pF (Total) ESD Protection: Yes Operating Temperature: -40C ~ 85C Applications: LAN, PCS, WAN Mounting Type: Surface Mount Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Height: 0.020" (0.50mm)	1000 Order	1+: $0
MRFE6VP61K25HR6 TR-ND	MRFE6VP61K25HR6	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Transistor Type: LDMOS (Dual) Frequency: 230MHz Gain: 24dB Voltage - Test: 50V Current - Test: 100mA Power - Output: 1250W Voltage - Rated: 133V Package / Case: NI-1230 Supplier Device Package: NI-1230 Base Part Number: MRFE6VP61K25	1000 Order	--
AFT09MP055GNR1- ND	AFT09MP055GNR1	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Transistor Type: LDMOS Frequency: 870MHz Gain: 15.7dB Voltage - Test: 12.5V Current - Test: 550mA Power - Output: 1W Voltage - Rated: 40V Package / Case: TO-270BB Supplier Device Package: TO-270 WB-4 Gull	1000 Order	500+: $8.8488
MRF6S20010NR1TR -ND	MRF6S20010NR1	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Transistor Type: LDMOS Frequency: 2.17GHz Gain: 15.5dB Voltage - Test: 28V Current - Test: 130mA Power - Output: 10W Voltage - Rated: 68V Package / Case: TO-270AA Supplier Device Package: TO-270-2 Base Part Number: MRF6S20010	1000 Order	500+: $17.5942
568-8497-2-ND	ON5089,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Active Package / Case: SOT-343F Supplier Device Package: SOT-343F	3000 Order	3000+: $0.0873 6000+: $0.083 15000+: $0.0795 30000+: $0.0773 75000+: $0.0754
MRF18085ALSR5-N D	MRF18085ALSR5	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: LDMOS Frequency: 1.81GHz ~ 1.88GHz Gain: 15dB Voltage - Test: 26V Current - Test: 800mA Power - Output: 85W Voltage - Rated: 65V Package / Case: NI-780S Supplier Device Package: NI-780S	1000 Order	1+: $0
568-11111-2-ND	BFG67/X,215	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 10V Frequency - Transition: 8GHz Noise Figure (dB Typ @ f): 1.3dB @ 1GHz Power - Max: 380mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 5V Current - Collector (Ic) (Max): 50mA Operating Temperature: 175C (TJ) Mounting Type: Surface Mount Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B Base Part Number: BFG67	1000 Order	1+: $0
PDTC114YK,115-N D	PDTC114YK,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1): 10 kOhms Resistor - Emitter Base (R2): 47 kOhms DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V Vce Saturation (Max) @ Ib, Ic: 100mV @ 250A, 5mA Current - Collector Cutoff (Max): 1A Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK Base Part Number: PDTC114	1000 Order	1+: $0
PDTC123JK,115-N D	PDTC123JK,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1): 2.2 kOhms Resistor - Emitter Base (R2): 47 kOhms DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V Vce Saturation (Max) @ Ib, Ic: 100mV @ 250A, 5mA Current - Collector Cutoff (Max): 1A Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK Base Part Number: PDTC123	1000 Order	1+: $0
PDTC323TK,115-N D	PDTC323TK,115	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 15V Resistor - Base (R1): 2.2 kOhms DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 50mA, 5V Vce Saturation (Max) @ Ib, Ic: 80mV @ 2.5mA, 50mA Current - Collector Cutoff (Max): 500nA Power - Max: 250mW Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	1000 Order	1+: $0
P4080NSE7PNAC-N D	P4080NSE7PNAC	NXP USA Inc	View more Series: QorIQ P4 Packaging: Tray Part Status: Active Core Processor: PowerPC e500mc Number of Cores/Bus Width: 8 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Security; SEC 4.0 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Ethernet: 1 Gbps (8), 10 Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0C ~ 105C (TA) Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5) Additional Interfaces: DUART, IC, MMC/SD, RapidIO, SPI Base Part Number: P4080	1000 Order	--
MK22FN1M0VLQ12- ND	MK22FN1M0VLQ12	NXP USA Inc	View more Series: Kinetis K20 Packaging: Tray Part Status: Not For New Designs Core Processor: ARM Cortex-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, IS, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 42x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: MK22FN1M0	1000 Order	60+: $7.2261
568-6617-ND	TDA9965HL/C3,15 1	NXP USA Inc	View more Packaging: Tray Part Status: Obsolete Type: CCD (Charged Coupled Device) Number of Channels: 1 Resolution (Bits): 12 b Sampling Rate (Per Second): 30M Data Interface: Serial Voltage Supply Source: Analog and Digital Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -20C ~ 75C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: TDA9965	1000 Order	1+: $0
LPC1112JHN33/10 3E-ND	LPC1112JHN33/10 3E	NXP USA Inc	View more Series: LPC1100XL Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: IC, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7) Base Part Number: LPC1112	1000 Order	260+: $1.0319
S9S12GN32ACFTR- ND	S9S12GN32ACFTR	NXP USA Inc	View more Series: HCS12 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	1000 Order	2000+: $1.1228
S9S12G64F0MLFR- ND	S9S12G64F0MLFR	NXP USA Inc	View more Series: HCS12 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: S9S12G64	1000 Order	2000+: $1.6172
S9S08AW16E5CFGE R-ND	S9S08AW16E5CFGE R	NXP USA Inc	View more Series: S08 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: IC, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	1000 Order	1500+: $1.9404
S912ZVC64F0VLF- ND	S912ZVC64F0VLF	NXP USA Inc	View more Series: S12 MagniV Packaging: Tray Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, IC, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 10x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	1000 Order	1250+: $2.0021
MC908JK1EMDWE-N D	MC908JK1EMDWE	NXP USA Inc	View more Series: HC08 Packaging: Tube Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Peripherals: LED, LVD, POR, PWM Number of I/O: 14 Program Memory Size: 1.5KB (1.5K x 8) Program Memory Type: FLASH RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 12x8b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC Base Part Number: MC908JK1	1000 Order	--
S912ZVML32F3VKH R-ND	S912ZVML32F3VKH R	NXP USA Inc	View more Series: S12 MagniV Packaging: Tape & Reel (TR) Part Status: Active Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 9x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP-EP (10x10)	1000 Order	1500+: $2.6536
MC9S08JE128CLH- ND	MC9S08JE128CLH	NXP USA Inc	View more Series: S08 Packaging: Tray Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 48MHz Connectivity: IC, SCI, SPI, USB Peripherals: LVD, POR, PWM, WDT Number of I/O: 33 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 6x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: MC9S08JE128	1000 Order	800+: $2.9002
S9S12HY32J0CLL- ND	S9S12HY32J0CLL	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 80 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	1000 Order	90+: $3.6937
S912XET256J2VAA -ND	S912XET256J2VAA	NXP USA Inc	View more Series: HCS12X Packaging: Tray Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	1000 Order	420+: $6.2398
S912XET256W1MAL R-ND	S912XET256W1MAL R	NXP USA Inc	View more Series: HCS12X Packaging: Tape & Reel (TR) Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	1000 Order	500+: $6.3854
S912XEQ512F1VAL -ND	S912XEQ512F1VAL	NXP USA Inc	View more Series: HCS12X Packaging: Tray Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40C ~ 105C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	1000 Order	300+: $8.4956
MCHC11F1CFNE2R- ND	MCHC11F1CFNE2R	NXP USA Inc	View more Series: HC11 Packaging: Tape & Reel (TR) Part Status: Not For New Designs Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 30 Program Memory Type: ROMless EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.75 V ~ 5.25 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25) Base Part Number: MCHC11	1000 Order	250+: $8.5151
MCF5373LCVM240- ND	MCF5373LCVM240	NXP USA Inc	View more Series: MCF537x Packaging: Tray Part Status: Not For New Designs Core Processor: Coldfire V3 Core Size: 32-Bit Speed: 240MHz Connectivity: EBI/EMI, Ethernet, IC, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Number of I/O: 62 Program Memory Type: ROMless RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V Oscillator Type: External Operating Temperature: -40C ~ 85C (TA) Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15) Base Part Number: MCF5373L	0 RFQ	630+: $9.5547
MCF53015CMJ240J -ND	MCF53015CMJ240J	NXP USA Inc	View more Series: MCF5301x Packaging: Tray Part Status: Not For New Designs Core Processor: Coldfire V3 Core Size: 32-Bit Speed: 240MHz Connectivity: EBI/EMI, Ethernet, IC, Memory Card, SPI, SSI, UART/USART, USB, USB OTG Peripherals: DMA, PWM, WDT Number of I/O: 83 Program Memory Type: ROMless RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA Base Part Number: MCF53015	1000 Order	450+: $9.6478
SP5745BBK1AMMH2 R-ND	SP5745BBK1AMMH2 R	NXP USA Inc	View more Series: MPC57xx Part Status: Active Core Processor: e200z4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, Ethernet, FlexRay, IC, LINbus, SPI Peripherals: DMA, IS, POR, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA)	1000 Order	1500+: $10.0297
S912XHZ512F1MAG -ND	S912XHZ512F1MAG	NXP USA Inc	View more Series: HCS12X Packaging: Tray Part Status: Not For New Designs Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, IC, IrDA, LINbus, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 117 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x8/10b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: S912XHZ512	1000 Order	300+: $10.5326
MCF5274VM166-ND	MCF5274VM166	NXP USA Inc	View more Series: MCF527x Packaging: Tray Part Status: Not For New Designs Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 166MHz Connectivity: EBI/EMI, Ethernet, IC, SPI, UART/USART, USB Peripherals: DMA, WDT Number of I/O: 69 Program Memory Type: ROMless RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Oscillator Type: External Operating Temperature: 0C ~ 70C (TA) Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA Base Part Number: MCF5274	1000 Order	450+: $14.2414
MC68332GVAG25-N D	MC68332GVAG25	NXP USA Inc	View more Series: M683xx Packaging: Tray Part Status: Not For New Designs Core Processor: CPU32 Core Size: 32-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Type: ROMless RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA) Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20) Base Part Number: MC68332	1000 Order	300+: $16.8815
SPC5775EDK3MME3 R-ND	SPC5775EDK3MME3 R	NXP USA Inc	View more Series: * Part Status: Active	1000 Order	500+: $17.1359
568-3602-2-ND	TDA8766G/C1,118	NXP USA Inc	View more Packaging: Tape & Reel (TR) Part Status: Obsolete Number of Bits: 10 Sampling Rate (Per Second): 20M Number of Inputs: 1 Input Type: Single Ended Data Interface: Parallel Configuration: ADC Number of A/D Converters: 1 Architecture: Sigma-Delta Reference Type: External Voltage - Supply, Analog: 3 V ~ 5.25 V Voltage - Supply, Digital: 3 V ~ 5.25 V Operating Temperature: 20C ~ 75C Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (5x5) Base Part Number: TDA8766	1000 Order	1+: $0

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