APR50-50-15CB/A01 Allicdata Electronics
Allicdata Part #:

APR50-50-15CB/A01-ND

Manufacturer Part#:

APR50-50-15CB/A01

Price: $ 7.37
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR50-50-15CB/A01 datasheetAPR50-50-15CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 6.63075
Stock 1000Can Ship Immediately
$ 7.37
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 1.953" (49.60mm)
Width: 1.953" (49.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.575" (14.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.54°C/W @ 200 LFM
Thermal Resistance @ Natural: 7.70°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

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Heat sinks are essential components in many systems, especially electronic and electrical systems, due to their ability to dissipate heat efficiently. As the name implies, a heat sink is an device that is used to dissipate heat from a certain device, usually by spreading the heat over a much larger surface area. One of the most common types of heat sinks is the APR50-50-15CB/A01.

The APR50-50-15CB/A01 is a heat sink made from aluminum and is typically used for cooling surface-mount components by absorbing and distributing heat away from them. It is designed to provide a high level of thermal performance for a wide variety of applications. It is ideal for use with a variety of processor packages, including BGA, FCC, and PGA.

The APR50-50-15CB/A01 is composed of a copper base and aluminum fins, which are combined in a single unit. The copper base absorbs heat from the attached device, and the aluminum fins help to spread the heat evenly over a larger surface area. The fins are designed to provide maximum surface area exposure, resulting in more efficient heat transfer from the component to the surrounding air. The copper base also ensures optimal thermal dissipation, while the aluminum fins effectively dissipate heat away from the components.

The APR50-50-15CB/A01 is a popular choice for many applications due to its excellent thermal performance and cost-effectiveness. It can be used in computer systems, electronics appliances, and other systems that require efficient heat dissipation. It is easily installed and does not require special tools or knowledge, making it an ideal choice for many applications.

The APR50-50-15CB/A01 is a versatile heat sink that is reliable, cost-effective, and flexible. Its unique design and structure make it an ideal choice for many applications, ranging from fans to computer systems. It is easy to install, durable, and efficient in heat dissipation, providing excellent thermal characteristics for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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