APR55-55-33CB/A01 Allicdata Electronics
Allicdata Part #:

APR55-55-33CB/A01-ND

Manufacturer Part#:

APR55-55-33CB/A01

Price: $ 10.98
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR55-55-33CB/A01 datasheetAPR55-55-33CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 9.87707
Stock 1000Can Ship Immediately
$ 10.98
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 2.150" (54.60mm)
Width: 2.150" (54.60mm)
Diameter: --
Height Off Base (Height of Fin): 1.283" (32.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 1.38°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.16°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The APR55-55-33CB/A01 is a thermal-heat sink designed to efficiently move heat away from a variety of electrical components. This technology is used to prevent high temperatures that can be dangerous to the components and can cause permanent damage, leaving them unusable. Heat sinks are usually made up of metal to take advantage of its high thermal conductivity and are used in different applications such as cooling processors used in computers.

The APR55-55-33CB/A01 is constructed of aluminum and comes in a variety of sizes, ranging from 25mm to 55mm in width, as well as up to 33mm in height. It features a series of slim fins made from aluminum that can quickly disperse heat and are ideal for use in smaller workstations or machines. The fins can be removed to increase the size of the sink and increase the amount of heat it can dissipate.

The APR55-55-33CB/A01 can be used in applications such as cooling microprocessors, integrated circuits, and power supplies. This thermal-heat sink utilizes a simple convection system to move heat away from the components and into the atmosphere. Heat is transferred from the components to the heat sink where it is then dissipated into the surrounding air by the fins. This is a simple and effective way to prevent components from overheating and becoming damaged.

The APR55-55-33CB/A01 also offers flexibility in its installation by allowing the user to mount the sink to a variety of surfaces. This includes surfaces such as flat metal panels, plastic, and wood. This offers many possibilities for designers, as the sink can be placed in areas or installations where a traditional air-cooled heat sink couldn’t be used.

The APR55-55-33CB/A01 is ideal for use in smaller machines and workstations, or situations where a more traditional air-cooled sink couldn’t be used due to space limitations. It is an effective and efficient way to keep electrical components from overheating and reduce the chances of them being damaged. While the APR55-55-33CB/A01 can be used in a variety of applications, it is important to remember that its success in cooling components depends on proper installation and maintenance of the system.

The specific data is subject to PDF, and the above content is for reference

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