APR55-55-28CB/A01

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The APR55-55-28CB/A01 is a revolutionary piece of technology in the field of Thermal-Heat Sinks. It is designed to provide maximum thermal transfer and a stable operating temperature for its applications. The APR55-55-28CB/A01 is made of high-grade aluminum and is designed specifically to maximise efficiency. This makes it suitable for use in high temperature, in high vibration or in high humidity environments.

The APR55-55-28CB/A01 features a unique pin-fin design that allows for better air flow and better thermal transfer between air and the heat sink. This pin-fin design also provides better electromagnetic interference shielding. The combination of the pin-fin design and its aluminum construction makes it very robust and will perform in harsh environments. The APR55-55-28CB/A01 also features a low profile, which allows it to be placed in tight spaces.

The APR55-55-28CB/A01 is designed to provide optimal performance even when dealing with high temperatures. Its thermal transfer rate is better than other similar thermal-heat sinks on the market, making it ideal for applications in servers, workstations and other environments that require maximum thermal transfer. It also features a highly efficient thermal regulation system, which helps reduce unnecessary energy losses and increases its performance.

The APR55-55-28CB/A01 has a number of features that make it an ideal solution for Thermal-Heat Sink applications. Its pin-fin design enables better air flow and increased thermal transfer, while its aluminum construction ensures a reliable and durable heat sink. Additionally, its low profile allows it to fit in tight spaces and its high efficiency thermal regulation system reduces energy losses in various applications. Finally, the APR55-55-28CB/A01 is a great choice for applications that demand maximum performance without any compromise.

The APR55-55-28CB/A01’s working principle is based on the dissipative effect of the heat sink. Heat travels from the component or PCB to the cooler surface of the heat sink, where it then dissipates outward. This process is made possible by an efficient cooling system, and is then regulated in various ways to attain maximum performance. The APR55-55-28CB/A01 features an adjustable fan speed for optimized cooling, as well as an adjustable thermal regulation system.

The APR55-55-28CB/A01 has been designed to meet the needs of a variety of Thermal-Heat Sink applications. It is suitable for a variety of electronics, including telecommunication systems, computers and more. It is an excellent choice for applications that require optimal thermal transfer, and is especially ideal for applications in high temperature, in high vibration or in high humidity environments.

In conclusion, the APR55-55-28CB/A01 is a revolutionary thermal-heat sink with an efficient pin-fin design and excellent thermal regulation capabilities. It is very robust and provides efficient thermal transfer even in harsh environments. It is an excellent choice for applications that require maximum performance and robustness, and is ideal for applications in high temperature, in high vibration or in high humidity environments.

The specific data is subject to PDF, and the above content is for reference