APR53-53-23CB/A01

Series:	APR
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Pin Fins
Length:	2.087" (53.02mm)
Width:	2.087" (53.02mm)
Diameter:	--
Height Off Base (Height of Fin):	0.890" (22.61mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Introduction

The APR53-53-23CB/A01 heat sink is an advanced thermal management solution designed primarily for use in high-power electronics and electrical components. It is a high-performance thermal device that offers superior cooling capacity without sacrificing performance or reliability. The APR53-53-23CB/A01 allows for efficient cooling of components such as ICs, LEDs, and other high-temperature electronic components. It is designed to provide an efficient heat transfer solution with a low-profile design.

Features of APR53-53-23CB/A01 Thermal Heat Sink

The APR53-53-23CB/A01 features a high-performance, low-profile design for optimum cooling efficiency. It utilizes a low-profile design with a small footprint to maximize space efficiency. The heat sink’s aluminum construction is lightweight and highly durable, with a minimum thermal resistance (Rth) of 0.55°C/W. The APR53-53-23CB/A01 features a 3.63mm heat spreader design and is compatible with standard-diameter hole patterns. It is also capable of connection to a metalized interface thanks to its high-performance silicone elastomeric gasket.

Application Field and Working Principle

The APR53-53-23CB/A01 heat sink is designed primarily for use in high-power applications. It is an excellent cooling solution for all types of components, including LEDs, amplifiers, and other high-power electronic devices that require efficient heat dissipation. The heat is dissipated thanks to the highly efficient thermal design of the heat sink and the high-performance silicone elastomeric gasket. This high-performance gasket ensures a secure connection between the heat sink and PCB.The APR53-53-23CB/A01 utilizes a two-stage thermal transfer process composed of a heat spreader and fins. The heat spreader reduces the maximum temperature of the components by spreading out the compressive temperatures produced by the surrounding environment. The fins then disperse the excess temperature, dissipating heat into the surrounding environment and cooling the components. This ensures that the maximum temperature of the components is not exceeded.

Conclusion

The APR53-53-23CB/A01 thermal heat sink is a high-performance thermal management solution designed specifically for use in high-power electronic devices. It features an efficient two-stage thermal transfer process and a low-profile design for optimum cooling efficiency. The heat sink is light-weight and highly durable, with a minimum thermal resistance of 0.55°C/W. The APR53-53-23CB/A01 is a great choice for efficient cooling of ICs, LEDs, and other high-power electronic components.

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