APR53-53-21CB/A01 Allicdata Electronics
Allicdata Part #:

APR53-53-21CB/A01-ND

Manufacturer Part#:

APR53-53-21CB/A01

Price: $ 8.88
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR53-53-21CB/A01 datasheetAPR53-53-21CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 7.99575
Stock 1000Can Ship Immediately
$ 8.88
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 2.087" (53.02mm)
Width: 2.087" (53.02mm)
Diameter: --
Height Off Base (Height of Fin): 0.811" (20.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

A heat sink is an important device used to dissipate heat in electronic and cooling systems. Heat sinks provide better cooling efficiency and performance than most other active or passive cooling solutions. The APR53-53-21CB/A01 is a heat sink designed to offer efficient cooling in a variety of applications, from aerospace to automotive.

Design

The APR53-53-21CB/A01 heat sink utilizes a two-stage design, consisting of a base plate and a fan shroud. The base plate is made of aluminum and includes channels for the airflow while the fan shroud is made of light weight polycarbonate. The combination of the two parts helps to reduce noise and vibration, and ensures effective cooling. The APR53-53-21CB/A01 also features a patented cooling technology that allows it to dissipate heat more efficiently than traditional heat sinks.

Performance

The APR53-53-21CB/A01 heat sink has been designed to provide superior cooling performance. It is capable of dissipating heat at temperatures up to 300°C (572°F). Its advanced technology also helps to reduce noise and vibration, allowing it to be used in quieter cooling systems. Additionally, it has been rated for over 18 years of optimal performance.

Application Field

The APR53-53-21CB/A01 heat sink is suitable for a wide variety of applications. It can be used in electronics, automotive, industrial, aerospace, medical, and military applications. It is capable of providing efficient cooling for a range of parts, components, and devices. Additionally, it is designed for use in harsh environments, such as in extreme temperatures or in extremely damp conditions.

Working Principle

The APR53-53-21CB/A01 heat sink is designed to operate by dissipating thermal energy from a component or device. Heat is generated by the component or device and then transferred to the heat sink. The heat sink then disperses the heat to the environment. The APR53-53-21CB/A01 features a two-stage design which helps to reduce noise and vibration, as well as providing more efficient cooling performance. The fan shroud also helps to direct the airflow for more efficient cooling.

The APR53-53-21CB/A01 heat sink provides superior cooling performance for a variety of applications. Its design and technology make it suitable for use in a range of environments and it has been rated for over 18 years of optimal performance. It is a reliable and efficient cooling solution for many applications.

The specific data is subject to PDF, and the above content is for reference

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