APR55-55-21CB/A01 Allicdata Electronics
Allicdata Part #:

APR55-55-21CB/A01-ND

Manufacturer Part#:

APR55-55-21CB/A01

Price: $ 10.45
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: APR55-55-21CB/A01 datasheetAPR55-55-21CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 9.40744
Stock 1000Can Ship Immediately
$ 10.45
Specifications
Series: APR
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Pin Fins
Length: 2.150" (54.60mm)
Width: 2.150" (54.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.811" (20.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.05°C/W @ 200 LFM
Thermal Resistance @ Natural: 6.49°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks have been used for many years as a way to dissipate heat from electronic devices. The APR55-55-21CB/A01 Heat Sink has been designed and developed as a cost-efficient solution for applications requiring low profile and long lasting thermal management. With excellent and robust performance, it can help protect against device failures from thermal overload.

The APR55-55-21CB/A01 Heat Sink is made from a robust aluminum alloy with a copper plating. The fin structure provides improved heat dissipation and airflow, enabling the device to operate at optimal thermal performance. It also features a high thermal resistance value, which increases the device efficiency and reliability. The heat sink comes with a mounting bracket that is compatible with several component types, such as capacitors, resistors and transistors.

The APR55-55-21CB/A01 Heat Sink can be used in a variety of applications. It is commonly used in power supplies, microprocessors, DSPs and ASICs. It is also used in automotive applications, LED lighting, and other power electronic devices. The device is designed to withstand high temperatures and is capable of dissipating up to 40 W of heat. It is also UL certified and RoHS compliant.

The working principle of the APR55-55-21CB/A01 Heat Sink is based on the concept of thermodynamics. Heat is dissipated away from the component by convection. Heat is transferred from the hot components to the cooler heat sink by thermal conduction. This process allows the heat to be dispersed quickly and more effectively. The aluminum alloy\'s structure helps to ensure that the heat is transferred away from the component quickly and evenly.

The APR55-55-21CB/A01 Heat Sink is an effective solution for those applications that require reliable thermal management. It is easy to install and maintain, ensuring that the device will last for a long time. The device is highly reliable and ensures that the components on which it is used remain at a safe and reliable temperature. It is also UL certified and RoHS compliant, ensuring that it meets all the necessary safety requirements.

The specific data is subject to PDF, and the above content is for reference

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