| Allicdata Part #: | APR53-53-28CB/A01-ND |
| Manufacturer Part#: |
APR53-53-28CB/A01 |
| Price: | $ 9.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | CTS Thermal Management Products |
| Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  APR53-53-28CB/A01 Datasheet/PDF |
| Quantity: | 1000 |
| 100 +: | $ 8.44921 |
Specifications
| Series: | APR |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins |
| Length: | 2.087" (53.02mm) |
| Width: | 2.087" (53.02mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.087" (27.60mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | -- |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum Alloy |
| Material Finish: | Black Anodized |
Description
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Thermal - Heat Sinks involve a metal or other conductive component that is capable of providing heat dissipation through conduction, convection, radiation, or combinations of each, and provide a mounting platform with which to mount it securely. The Thermal – Heat Sink APR53-53-28CB/A01 applies cutting-edge thermal design technology which delivers the performance of a fan-based solution without the needs of a fan or its associated maintenance costs. The APR53-53-28CB/A01 provides unprecedented performance and cooler operation while optimizing the balance between heat dissipation and space consumption.
The APR53-53-28CB/A01 is designed to handle up to 5 Watts of power dissipation. Its integrated heat transfer technology efficiently control the thermal resistance of heat conductivity combined with convection in order to provide the target performance, resulting in a very efficient thermal solution. Its innovative design magnifies the thermal conductivity features to improve its ability to dissipate the heat generated through the components. The design consists of two parts, the first part is composed of metal blade fin profiles that maximize the surface area and, the second part consists of heat-conducting material which is used to provide the heat transfer from the components to the fins of the heat sink.
The APR53-53-28CB/A01 is housed in a compact low profile design, making it an ideal choice for space-constrained applications. Its performance is maximized by the highly efficient heat conching design performed in combination with the cutting-edge thermal design technology. This design results in significantly cooler operation and improved thermal performance under a wide range of operating temperatures and conditions. With its integrated fin profile and conching design, the APR53-53-28CB/A01 is capable of dissipating heat more effectively than a fan-based solution, without sacrificing performance.
This Thermal – Heat Sink is suitable for communications, broadcasting, consumer electronics, medical electronics, and a variety of other applications. Its innovative dual-profile heat transfer technology can be used in any application where heat dissipation and space constraints are major considerations. The APR53-53-28CB/A01 provides both high-efficiency heat transfer and low-power consumption in most scenarios.
In conclusion, the APR53-53-28CB/A01 is a reliable and efficient thermal solution for a wide range of applications. It offers impressive thermal performance and cooler operation, while maintaining low levels of power consumption. This thermal solution can be used in a variety of applications where space constraints and heat dissipation are the main considerations. The APR53-53-28CB/A01 is compact yet highly effective, and easy to install and maintain.
The APR53-53-28CB/A01 is designed to handle up to 5 Watts of power dissipation. Its integrated heat transfer technology efficiently control the thermal resistance of heat conductivity combined with convection in order to provide the target performance, resulting in a very efficient thermal solution. Its innovative design magnifies the thermal conductivity features to improve its ability to dissipate the heat generated through the components. The design consists of two parts, the first part is composed of metal blade fin profiles that maximize the surface area and, the second part consists of heat-conducting material which is used to provide the heat transfer from the components to the fins of the heat sink.
The APR53-53-28CB/A01 is housed in a compact low profile design, making it an ideal choice for space-constrained applications. Its performance is maximized by the highly efficient heat conching design performed in combination with the cutting-edge thermal design technology. This design results in significantly cooler operation and improved thermal performance under a wide range of operating temperatures and conditions. With its integrated fin profile and conching design, the APR53-53-28CB/A01 is capable of dissipating heat more effectively than a fan-based solution, without sacrificing performance.
This Thermal – Heat Sink is suitable for communications, broadcasting, consumer electronics, medical electronics, and a variety of other applications. Its innovative dual-profile heat transfer technology can be used in any application where heat dissipation and space constraints are major considerations. The APR53-53-28CB/A01 provides both high-efficiency heat transfer and low-power consumption in most scenarios.
In conclusion, the APR53-53-28CB/A01 is a reliable and efficient thermal solution for a wide range of applications. It offers impressive thermal performance and cooler operation, while maintaining low levels of power consumption. This thermal solution can be used in a variety of applications where space constraints and heat dissipation are the main considerations. The APR53-53-28CB/A01 is compact yet highly effective, and easy to install and maintain.
The specific data is subject to PDF, and the above content is for reference
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