AS4C256M8D3-12BCN

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Memory is an important component in any computer system. The AS4C256M8D3-12BCN is a type of memory module that can be used in applications ranging from embedded to high-performance computing. This module combines low-power operation with high-speed operations.

The AS4C256M8D3-12BCN is a Double Data Rate 3 (DDR3) memory module. It is organized as a x4, x8, x16, or x32 Massive Expanding Memory. It has a maximum transfer rate of 12.8 GB/s (gigabytes per second). It is compliant with JEDEC 1.5V standard version 3.2 for DDR3 memory. The module has low power consumption compared to the DDR2 memory module.

The AS4C256M8D3-12BCN is ideal for applications that need large amounts of data to be processed quickly. Examples include server, data center, and high-performance computing. It is also suitable for embedded applications such as aerospace, medical, and industrial machines.

The working principle of the AS4C256M8D3-12BCN is based on parallel processing of data. The module operates by transferring data chunks in synchronization with a clock signal. It ensures that data is not lost or corrupted during the data transfer process.

The AS4C256M8D3-12BCN is designed to be hot-swappable. This feature allows the module to be replaced and upgraded in a few seconds. It also allows a user to change the capacity of the module to meet the changing requirements of an application.

The AS4C256M8D3-12BCN is a low-power, high-performance memory module. It is ideal for embedded and high-performance computing applications that need large amounts of data to be processed quickly. It operates by leveraging parallel data transfer and is hot-swappable. With these features, the module provides users with a powerful tool to handle their data processing needs.

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