AS4C4M16D1-5TCN Allicdata Electronics
Allicdata Part #:

1450-1007-ND

Manufacturer Part#:

AS4C4M16D1-5TCN

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Alliance Memory, Inc.
Short Description: IC DRAM 64M PARALLEL 66TSOP II
More Detail: SDRAM - DDR Memory IC 64Mb (4M x 16) Parallel 200M...
DataSheet: AS4C4M16D1-5TCN datasheetAS4C4M16D1-5TCN Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Series: --
Packaging: Tray 
Part Status: Obsolete
Memory Type: Volatile
Memory Format: DRAM
Technology: SDRAM - DDR
Memory Size: 64Mb (4M x 16)
Clock Frequency: 200MHz
Write Cycle Time - Word, Page: 15ns
Access Time: 700ps
Memory Interface: Parallel
Voltage - Supply: 2.3 V ~ 2.7 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 66-TSSOP (0.400", 10.16mm Width)
Supplier Device Package: 66-TSOP II
Description

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AS4C4M16D1-5TCN is a class of 4 megabyte (MB) DDR3 SDRAM components that are designed to be used in memory modules. Due to its low profile and wide range of available speeds and capacities, these components are ideal for use in embedded systems with limited space and power requirements. Its small footprint enables memory modules to fit in even the most space-restricted systems, while its high-performance throughput allows for quick access to memory when used in systems that require quick response times.

The AS4C4M16D1-5TCN component is composed of 8 memory chips each containing 8 x 4MB of memory banks. Each memory bank is then connected to a 3.2V 32-bit data bus, which enables the AS4C4M16D1-5TCN component to interact with the system processor. This data bus carries both the address and data taking or writing from the memory banks.

The AS4C4M16D1-5TCN component is built utilizing the “Dual Output” device architecture, which reduces the overall footprint and power requirements compared to the industry standard “Quad Output” device architecture. This architecture enables the component to operate at 1.35V instead of the standard 1.8V. This reduces the power draw, improving power efficiency and system thermal dissipation.

The AS4C4M16D1-5TCN component is composed of two types of memory: SDRAM and DDR3. SDRAM (Synchronous Dynamic Random Access Memory) is designed to be accessed on demand, when the system requests data. In contrast, DDR3 (Double Data Rate 3 Synchronous DRAM) is a type of memory that can access data twice as fast as SDRAM. As a result, DDR3 is becoming increasingly popular in modern computer systems, especially those that are running demanding workloads.

The AS4C4M16D1-5TCN component uses an advanced “clock frequency synchronization” method in order to enable high-speed data transfer. This method ensures that data is always sent and received at the correct speed and timing by the system processor. The component is also designed with a built-in ECC (Error Correcting Code) feature, which allows the memory to detect and correct any errors that may occur when accessing or transferring data.

The AS4C4M16D1-5TCN component is capable of operating at speed grades of DDR3-1066, DDR3-1333, or DDR3-1600, which allows for maximum throughput when used in a wide variety of systems. The low power requirements and small form factor of the AS4C4M16D1-5TCN component makes it ideal for use in embedded systems, where power and space are critical. In addition, it can be used in desktops, laptops, and other systems where performance and energy efficiency are important.

In addition to its low profile and wide range of available speeds and capacities, the AS4C4M16D1-5TCN component is also designed to be compatible with various types of memory controllers. This allows the component to be used in various types of systems without any performance or compatibility issues. Finally, the component is also designed to be used in an Extended Temperature Range (ETR) environment, making it suitable for use in applications that may operate in extreme temperatures.

The AS4C4M16D1-5TCN component is an ideal solution for any system that requires a low profile, high performance memory component. With its small size and low power draw, the component is perfect for embedded applications, where power and space are limited. In addition, its wide range of supported speeds and capacities, as well as its compatibility with various memory controllers, make it a versatile and cost effective choice for any application.

The specific data is subject to PDF, and the above content is for reference

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