ES1JFL RVG Discrete Semiconductor Products

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1. FEATURES

    1. Glass passivated junction chip

    2. Ideal for automated placement

    3. Low profile package

    4. Low power loss, high efficiency 

    5. Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC

    6. Halogen-free according to IEC 61249-2-21

2. MECHANICAL DATA

    1. Molding compound meets UL 94 V-0 flammability rating

    2. Moisture sensitivity level: level 1, per J-STD-020

    3. Packing code with suffix "G" means green compound (halogen-free)

    4. Terminal: Matte tin plated leads, solderable per J-STD-002

    5. Meet JESD 201 class 1A whisker test

    6. Polarity: As marked

    7. Weight: 16 mg (approximately)

3. APPLICATIONS

   1. High frequency rectification  

   2. Freewheeling application 

   3. Switching mode converters and inverters in computer, automotive and telecommunication.

4. Electrical Specifications

5. Package overview