
Allicdata Part #: | MT47H32M16BN-37EIT:DTR-ND |
Manufacturer Part#: |
MT47H32M16BN-37E IT:D TR |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Micron Technology Inc. |
Short Description: | IC DRAM 512M PARALLEL 84FBGA |
More Detail: | SDRAM - DDR2 Memory IC 512Mb (32M x 16) Parallel 2... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | 0.00000 |
Write Cycle Time - Word, Page: | 15ns |
Base Part Number: | MT47H32M16 |
Supplier Device Package: | 84-FBGA (10x12.5) |
Package / Case: | 84-TFBGA |
Mounting Type: | Surface Mount |
Operating Temperature: | -40°C ~ 95°C (TC) |
Voltage - Supply: | 1.7 V ~ 1.9 V |
Memory Interface: | Parallel |
Access Time: | 500ps |
Series: | -- |
Clock Frequency: | 267MHz |
Memory Size: | 512Mb (32M x 16) |
Technology: | SDRAM - DDR2 |
Memory Format: | DRAM |
Memory Type: | Volatile |
Part Status: | Obsolete |
Packaging: | Tape & Reel (TR) |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
MT47H32M16BN-37E IT:D TR is a part of the extended range of memory device solutions that are designed for high speed, low-power requirements in numerous applications. As a Double Data Rate (DDR) synchronous DRAM, MT47H32M16BN-37E IT:D TR can be applied in a wide array of applications such as network processor systems, graphics solutions, digital video solutions, embedded computing solutions, caching and buffering solutions, enterprise server solutions, and memory access systems.
MT47H32M16BN-37E IT:D TR works by utilizing two data buses simultaneously as they interface with internal banks of DRAM modules. Clocking occurs in both rising and falling edges of the data buses, allowing for maximum performance of the memory module. The result of this technique is a higher data throughput than what can be attained with DRAM solutions that utilize a single data bus. As a result, MT47H32M16BN-37E IT:D TR is well suited for memory intensive applications that require fast access times, such as networks, multimedia, and mission-critical applications.
For superior bandwidth performance, MT47H32M16BN-37E IT:D TR also uses on-die termination, or ODT, to make sure that signals from the data buses are properly terminated at the chip level to ensure maximum reliability and ensure that signal integrity is maintained. This is coupled with the advanced LVDS bus architecture that is designed for high speed performance, ensuring that data transfer between memory devices is consistently reliable and accurate.
In order to meet the power requirement of the various applications that MT47H32M16BN-37E IT:D TR is used in, the memories are able to operate at a variety of different operating voltages. This allows for a flexible power range, allowing for efficient operation in a wide array of applications. Furthermore, the memories are designed to support high temperature environments, which allows them to be deployed in a wide range of applications from digital signal processing to motor control.
To ensure the reliability and accuracy of the data that is being stored and accessed, MT47H32M16BN-37E IT:D TR is built with a variety of error correction features. These features include CRC parity checks and on-chip ECC algorithms. The error-correcting code ensures that any errors that occur when data is being accessed or sent to the memory device are corrected, ensuring that data is accurately transmitted at all times.
Overall, MT47H32M16BN-37E IT:D TR is an excellent solution for a variety of memory intensive applications. Its two data buses and advanced LVDS bus architecture enable it to have a significant increase in data transfer speeds and throughput, making it ideal for memory intensive applications. Furthermore, its versatility in terms of operating voltages and its high-temperature capability enables it to be deployed in a wide variety of applications. Its error correction features ensure that data is being accurately stored and accessed at all times. As a result, MT47H32M16BN-37E IT:D TR is an excellent choice for use in a wide range of memory applications.
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