R5009FNX Allicdata Electronics
Allicdata Part #:

R5009FNX-ND

Manufacturer Part#:

R5009FNX

Price: $ 2.65
Product Category:

Discrete Semiconductor Products

Manufacturer: ROHM Semiconductor
Short Description: MOSFET N-CH 500V 9A TO-220FM
More Detail: N-Channel 500V 9A (Tc) 50W (Tc) Through Hole TO-22...
DataSheet: R5009FNX datasheetR5009FNX Datasheet/PDF
Quantity: 678
1 +: $ 2.41290
10 +: $ 2.15523
100 +: $ 1.76740
500 +: $ 1.43119
1000 +: $ 1.20702
Stock 678Can Ship Immediately
$ 2.65
Specifications
Vgs(th) (Max) @ Id: 4V @ 1mA
Package / Case: TO-220-3 Full Pack
Supplier Device Package: TO-220FM
Mounting Type: Through Hole
Operating Temperature: 150°C (TJ)
Power Dissipation (Max): 50W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 630pF @ 25V
Vgs (Max): ±30V
Gate Charge (Qg) (Max) @ Vgs: 18nC @ 10V
Series: --
Rds On (Max) @ Id, Vgs: 840 mOhm @ 4.5A, 10V
Drive Voltage (Max Rds On, Min Rds On): 10V
Current - Continuous Drain (Id) @ 25°C: 9A (Tc)
Drain to Source Voltage (Vdss): 500V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Not For New Designs
Packaging: Bulk 
Description

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The R5009FNX is a 30V single N-channel advanced power MOSFET from ROHM Semiconductor. It offers low gate charge, low on-state resistance, and fast switching, making it suitable for use in a wide range of applications including power switching, circuit switching, and power supplies. R5009FNX is designed specifically to meet the high-frequency, high-current requirements of MOSFET switching applications. Specifically, it is able to handle high current with low leakage, while suppressing the reverse recovery time. As a result, it is ideal for use in high-speed switching circuits.

The R5009FNX is an N-channel advanced power MOSFET, meaning it utilizes the most common construction of power MOSFETs. This construction consists of an insulated gate layer that is sandwiched between a source region, which is heavily doped with electrons, and a drain region that is heavily doped with holes. The gate layer is typically made from gallium arsenide, indium gallium arsenide, or other types of semiconductor materials. The gate layer controls the current flowing through the MOSFET, based on the electrical charge applied to the gate. The gate charge for the R5009FNX is low, allowing for improved switching speed and reduced power consumption.

The on-state resistance of the R5009FNX is also low, allowing for improved efficiency in power switching applications. The device\'s low on-state resistance is achieved by the use of a heavily doped drain region, which reduces the resistance between the source and drain regions. This results in a low on-state resistance, ensuring that power is efficiently transferred across the channel.

The R5009FNX is also designed to handle high currents with low leakage. Due to the heavily doped drain region, the device has a low reverse leakage current when the gate-source voltage is below the threshold. The low leakage enables the device to handle high currents while minimizing power losses. Additionally, the suppression of reverse recovery time ensures that the device will not suffer from power losses due to a backlog of current.

Overall, the R5009FNX is a voltage-controlled, high-switching speed single N-channel advanced power MOSFET. It offers low gate charge, low on-state resistance, and fast switching, making it suitable for use in applications such as power switching, circuit switching, and power supplies. Additionally, it is designed to handle high currents with low leakage, while suppressing reverse recovery time. As a result, the R5009FNX is an ideal choice for any application that requires high-speed switching, high current handling, and low power consumption.

The specific data is subject to PDF, and the above content is for reference

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