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Sockets for ICs, Transistors

SIP050-1X14-160BLF Application Field and Working Principle

SIP050-1X14-160BLF is an integrated socket product that includes an insulation support and heat-dissipating adhesive that enable an effective solution for applications requiring high density pcb placement. This product is often used in the telecom and consumer products industries. It is commonly used as interconnection between different printed circuit boards.

Application Fields

• Telecommunication and network equipment
• Audio and video equipment
• Computer system equipment
• Consumer electronic products

Working Principle

SIP050-1X14-160BLF Integrated Socket supports up to sixteen leads with lead spacing ranging from 0.76 mm to 2.54 mm. The gold-plated contact element provides soldering operations, allowing quick connection between two printed circuit boards. The use of die-casting heat dissipating material in the base of the product ensures that the pin temperature remains low and it can provide support for up to 1.5 A of current. A lower mechanical contact resistance is achieved by the use of small contact areas on the contact element that can provide and maintain a low contact resistance with a maximum operating temperature of 125° C. Through testing, the resistance of the contact element after plug-in is within 5 mΩ.

Conclusion

The SIP050-1X14-160BLF Integrated Socket is a high-density product with a wide range of applications, allowing for stable and reliable electrical connections between different printed circuit boards. The product is able to provide and maintain a low contact resistance up to a maximum operating temperature of 125° C. Its versatile design allows for a variety of equipment and devices to benefit from its effective and durable performance.

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