SIP050-1X07-157BLF

Series:	SIP050-1x
Packaging:	Bulk
Part Status:	Obsolete
Type:	SIP
Number of Positions or Pins (Grid):	7 (1 x 7)
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Tin
Contact Finish Thickness - Mating:	200.0µin (5.08µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Closed Frame
Termination:	Solder
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Tin
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Material - Post:	Brass
Housing Material:	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:	--
Termination Post Length:	0.095" (2.41mm)
Material Flammability Rating:	UL94 V-0
Contact Resistance:	--

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Sockets for ICs, Transistors

SIP050-1X07-157BLF is a type of socket device that is designed specifically for integrated circuits (ICs) and transistors. It provides a reliable and secure connection between a circuit board and ICs or transistors, ensuring a high quality of signal transmission. This socket device is greatly suitable for ICs and transistors that require a high-speed, reliable performance.

Application Field

As a reliable connection for integrated circuits and transistors, SIP050-1X07-157BLF is widely used in various electronic fields. This socket device is popularly used in many consumer products, such as mobile phones, digital cameras, home appliances, and so on. It can also be used in industrial, communication and automotive applications, providing a secure and reliable connection for data transmission.

Working Principle

The working principle of the SIP050-1X07-157BLF socket device is based on a patented conductive contact interface. This contact interface is designed to securely and reliably connect pin-section components and substrate materials with reliable electrical performance. The conductive contacts ensure that the connection between circuit substrates and components is maintained for a long time, while avoiding the need for frequent maintenance.The socket device also uses a cooperating clamp mechanism to securely and reliably lock the components and substrate in place. This prevents accidental dropping and displacement of the components and protects them against vibration and shock. It also ensures that the connection is highly stable, with minimum signal losses and no electrical noise.In addition, the SIP050-1X07-157BLF socket device is also designed for easy operation and minimum assembly time. The assembly requires minimal manual manipulation, with no complex tools required. This ensures fast connection and increased productivity during the assembly process.In conclusion, the SIP050-1X07-157BLF socket device is a great option for integrated circuits and transistors that require a reliable and secure connection between a circuit board and components. With its patented contact interface and cooperating clamp mechanism, it offers an easily operated and highly reliable connection. It is suitable for various consumer and industrial applications.

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Part Number	Manufacturer	Price	Quantity	Description