SIP050-1X10-157BLF

Series:	SIP050-1x
Packaging:	Bulk
Part Status:	Obsolete
Type:	SIP
Number of Positions or Pins (Grid):	10 (1 x 10)
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Tin
Contact Finish Thickness - Mating:	200.0µin (5.08µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Closed Frame
Termination:	Solder
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Tin
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Material - Post:	Brass
Housing Material:	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:	--
Termination Post Length:	0.095" (2.41mm)
Material Flammability Rating:	UL94 V-0
Contact Resistance:	--

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The SIP050-1X10-157BLF is a socket solution for interconnecting integrated circuits (ICs), transistors, and other types of electronic components. It is typically used with double-sided printed circuit boards (PCBs) connected in a “daisy-chain” configuration. The socket is a reliable and easy to use solution for a variety of IC applications. It can be used with both through-hole and surface mount components, which makes it an especially versatile option.This socket solution consists of a polyvinylchloride (PVC) base plate, an insulation cover plate, and a top plate. The base plate has a rectangular shape and is designed to minimise its surface area when mounting on a PCB. This makes it easier to fit in tight spaces and can reduce the potential for shorts or other problems due to overcrowding. The insulation cover plate provides electrical isolation between the top plate and the components attached underneath, which can be beneficial in some applications. The top plate is made of aluminum and it has a grid of indents to help secure components to the socket.To connect components to the SIP050-1X10-157BLF, the pins of the connected devices are first inserted into the holes of the top plate. Then the pins are soldered onto the top plate for secure connection. Then the insulation cover plate is placed on top the pins. Finally, the base plate is mounted on the PCB and the entire socket is secured with screws.The SIP050-1X10-157BLF socket offers a number of advantages over other socket solutions. For example, the top plate helps provide a secure connection between the component pins and the socket, which helps reduce the chance of short circuits during operation. The insulation cover plate provides additional protection against shorts and can help reduce electromagnetic radiation leakage. The specialized base plate design also helps reduce the potential for overcrowding on the PCB.Overall, the SIP050-1X10-157BLF socket solution is a reliable and easy to use solution for a variety of IC applications. It is a versatile option for both through-hole and surface mount components, and its specialized features help ensure secure and reliable connections. This socket solution is an excellent choice for both commercial and industrial applications.

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