SIP050-1X12-157BLF Allicdata Electronics
Allicdata Part #:

SIP050-1X12-157BLF-ND

Manufacturer Part#:

SIP050-1X12-157BLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SOCKET SIP 12POS TIN
More Detail: N/A
DataSheet: SIP050-1X12-157BLF datasheetSIP050-1X12-157BLF Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: SIP050-1x
Packaging: Bulk 
Part Status: Obsolete
Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature: --
Termination Post Length: 0.095" (2.41mm)
Material Flammability Rating: UL94 V-0
Contact Resistance: --
Description

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Sockets for ICs, Transistors

The SIP050-1X12-157BLF socket is designed to facilitate electric connection of ICs, transistors, and other electronic components to a printed circuit board (PCB). It is widely used in many electronic devices, from microelectronic systems to home appliances. This article will discuss the application field and working principle of the SIP050-1X12-157BLF socket.

Application Field

The SIP050-1X12-157BLF socket is primarily used in applications demanding a strong yet flexible connection between electronic components and a PCB. This socket is designed for use in medium and high frequency applications, and is particularly suited for use in applications requiring a high degree of temperature stability. It is particularly suitable for semi-batch and batch processing of ICs, transistors, SMDs, and other components. The socket is also compatible with various types of single-in-line packages, double-in-line packages, as well as other SMT packaging. The SIP050-1X12-157BLF socket can be used in a variety of electronic devices, ranging from simple LED lights to sophisticated defense and aerospace systems.

Working Principle

The SIP050-1X12-157BLF socket uses a four-point spring-pin design. The spring pins are optimized for electrical and mechanical performance, and their shape ensures reliable contact between the pins and the IC, transistor, or other component. The socket\'s housing is composed of an upper shell and a lower shell which form a single body when mated together. The upper shell has four posts, each equipped with two spring pins. The lower shell is secured to the PCB via mounting tabs, providing additional mechanical stability. Internally, the two shells are interconnected by a metal spring plate which ensures optimal contact force on the pins.

Conclusion

The SIP050-1X12-157BLF socket is an ideal solution for reliable and robust connection of ICs, transistors, and other components. Its four-pin spring-pin design ensures a reliable contact, while its strong and flexible construction enables it to be used in a wide variety of applications. The socket\'s upper and lower shell also ensure that the PCB and component are securely held in place. Therefore, the SIP050-1X12-157BLF socket is an excellent choice for ensuring reliable electric connection between PCBs and components.

The specific data is subject to PDF, and the above content is for reference

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