Allicdata Part #: | AER50-50-15CB/A01-ND |
Manufacturer Part#: |
AER50-50-15CB/A01 |
Price: | $ 7.37 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | AER50-50-15CB/A01 Datasheet/PDF |
Quantity: | 1000 |
100 +: | $ 6.63075 |
Series: | AER |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Fins |
Length: | 1.953" (49.60mm) |
Width: | 1.953" (49.60mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.575" (14.60mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.35°C/W @ 200 LFM |
Thermal Resistance @ Natural: | 7.98°C/W |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks Application and Working Principle of AER50-50-15CB/A01
Heat sinks are devices designed to dissipate the heat generated by an electronic component, allowing the component to maintain optimum temperature and function as desired. Among them, AER50-50-15CB/A01 is one of the most commonly used heat sinks. This article will focus on the application and working principle of this type of heat sink.
Application
AER50-50-15CB/A01 heat sinks are mainly applied in places where thermoelectric components require higher cooling performance. The thermoelectric components may be passive elements, such as processors, transistors, diodes, and LEDs, or active elements, such as transformers, power amplifiers, inverters, and transistors. Common applications of AER50-50-15CB/A01 heat sinks include computer, telecom, and consumer electronics.
Working Principle
AER50-50-15CB/A01 heat sinks operate on a simple yet effective working principle. The heat sink has a large surface area that is exposed to the air. The air on the sides of the heat sink is constantly moving due to convection currents. As the air flows skims past the heat sink, it causes the heat to dissipate away from the heat sink. This cooling can keep the temperature of the component at an optimal temperature for greater longevity.
The heat sink also passively utilizes conductive and radiative methods to dissipate heat from components. The large surface area also increases the chances of radiative heat dissipation. This helps to further increase the efficiency of heat dissipation. Additionally, the heat sink is designed with a fin-structure which gives it a greater surface area, allowing for better cooling.
Conclusion
From the above, it can be concluded that AER50-50-15CB/A01 is an effective heat sink that can be used to keep thermoelectric components in optimal working conditions. This heat sink is designed with an efficient fin-structure which allows for the best possible dissipation of heat from the component. The heat sink is highly effective and is widely used for various thermoelectric components, found in consumer electronics, telecom, and computer industries.
The specific data is subject to PDF, and the above content is for reference
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