AER55-55-12CB/A01 Allicdata Electronics
Allicdata Part #:

AER55-55-12CB/A01-ND

Manufacturer Part#:

AER55-55-12CB/A01

Price: $ 9.93
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER55-55-12CB/A01 datasheetAER55-55-12CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 8.93788
Stock 1000Can Ship Immediately
$ 9.93
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 2.150" (54.60mm)
Width: 2.150" (54.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.457" (11.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.57°C/W @ 200 LFM
Thermal Resistance @ Natural: 8.04°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The AER55-55-12CB/A01 thermal-heat-sinks can be used extensively in a variety of applications due to its advantageous combination of physical properties and high performance capabilities. The AER55-55-12CB/A01 thermal-heat-sinks performance characteristics include a high heat dissipation capability, size efficiency, and excellent structural stability. These features make it ideal for applications where efficient thermal management and high performance capabilities are critical.

The structure of the AER55-55-12CB/A01 thermal-heat-sink is composed of a base plate, heat dissipation fins, and heat dissipation tubes. The aluminum base plate is designed with air vents and openings to allow for adequate air flow through the unit to maximize heat dissipation. These air vents are protected by a stainless steel screen to ensure that dust, debris, and other contaminants do not enter the unit and reduce its heat dissipation capability. The heat dissipation fins are designed to mount onto the base plate with studs or screws and create an efficient system to dissipate heat away from the heat generating components. The heat dissipation tubes are used to connect directly the heat generating components to the fins, allowing a pathway for heat to be conducted to the fins so that it can be dissipated away from the heat generating component.

The AER55-55-12CB/A01 thermal-heat-sink is designed to provide an efficient way to manage and control heat generated by electronic components. The high heat dissipation capability of the thermal-heat-sink allows the unit to effectively dissipate heat from components, while its size efficiency means that it occupies a smaller amount of space than other heat management solutions. In addition, the structural stability of the unit ensures that it can be mounted securely in the most demanding applications.

The AER55-55-12CB/A01 thermal-heat-sink can be used in a variety of applications, such as computers, LED lighting, medical equipment, and automotive electronics. It is also used in a variety of industrial and consumer appliances. The unit is particularly well suited for applications that require a high level of heat management and performance, such as those found in servers, gaming consoles, and data centers.

The AER55-55-12CB/A01 thermal-heat-sink is an ideal choice for applications where efficient heat management and high performance capabilities are needed. Its combination of high performance capabilities, size efficiency, and structural stability make it an ideal choice for a variety of applications. The unit is designed to efficiently dissipate heat and provide the best thermal management solutions for applications that require efficient heat management and performance.

The specific data is subject to PDF, and the above content is for reference

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