AER55-55-23CB/A01 Allicdata Electronics
Allicdata Part #:

AER55-55-23CB/A01-ND

Manufacturer Part#:

AER55-55-23CB/A01

Price: $ 10.45
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER55-55-23CB/A01 datasheetAER55-55-23CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 9.40744
Stock 1000Can Ship Immediately
$ 10.45
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 2.150" (54.60mm)
Width: 2.150" (54.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.890" (22.61mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 1.67°C/W @ 200 LFM
Thermal Resistance @ Natural: 6.60°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are used to dissipate heat from hot surfaces or components in order to maintain a desired temperature level. This is usually accomplished by exposing the heat-generating components or surfaces to a larger surface area that acts as a heat sink. The AER55-55-23CB/A01 heat sinks are specifically designed for this purpose.

The AER55-55-23CB/A01 thermal heat sink is a thermally efficient aluminum heat sink that features special fins designed to move heat away from the hot surfaces. The heat sink is designed with an extremely low thermal resistance of just 0.9 degrees Celsius per watt and a high fin density to increase its heat transfer efficiency. It also features a highly reflective black finish to further reduce thermal losses.

The AER55-55-23CB/A01 thermal heat sink is typically used in applications such as electronics, automotive, aerospace, robotics, energy, and industrial. It is often used in power conversion applications where power transistors, MOSFETs, IGBTs, and other components generate a lot of heat during operations. The AER55-55-23CB/A01 heat sink is highly effective at dissipating heat quickly and efficiently, allowing the components to remain cool and operate correctly.

The AER55-55-23CB/A01 thermal heat sink is designed to operate via natural convection or forced convection. Natural convection is the process where air is naturally drawn to the heat source by differences in hot and cold air density, while forced convection involves using a fan to direct air towards the heat source. Natural convection is usually more efficient and energy-saving but is limited by the size of the heat sink and the airflow characteristics of the environment. Forced convection, on the other hand, can be more powerful but is limited by the airflow characteristics of the fan.

The AER55-55-23CB/A01 thermal heat sink also features integrated heat-absorbing and heat-conducting materials that are designed to draw heat away from the device. These materials can include high-conductivity materials such as copper, aluminum, or other alloys which are bonded to the surface of the heat sink. The materials are designed to increase the heat sink\'s thermal efficiency by enhancing heat transfer and improving air circulation.

The AER55-55-23CB/A01 thermal heat sink is designed to provide a reliable and efficient means of cooling components. It features advanced fin design for optimal heat dissipation, an extremely low thermal resistance, and an integrated reflective black finish to reduce thermal losses. With its advanced design and high level of efficiency, the AER55-55-23CB/A01 heat sink is the perfect solution for cooling applications in a wide variety of industries.

The specific data is subject to PDF, and the above content is for reference

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