AER53-53-12CB/A01 Allicdata Electronics
Allicdata Part #:

AER53-53-12CB/A01-ND

Manufacturer Part#:

AER53-53-12CB/A01

Price: $ 8.40
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER53-53-12CB/A01 datasheetAER53-53-12CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 7.55762
Stock 1000Can Ship Immediately
$ 8.4
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 2.087" (53.02mm)
Width: 2.087" (53.02mm)
Diameter: --
Height Off Base (Height of Fin): 0.457" (11.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: --
Thermal Resistance @ Natural: --
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

When it comes to cooling of sensitive electronic components, heat sinks are essential. The AER53-53-12CB/A01 heat sink is among the most reliable and efficient options for thermal management. With its functional design, this product excels at maximum heat dissipation and reliability in varaity of applications.

Applications

The AER53-53-12CB/A01 heat sink is capable of operating effectively over a wide temperature range. It incorpoates an array of fins which provide large surface area to improve heat dissipation. It can be used for cooling of high power electronic components and equipment, such as dynamic generators and converters, microprocessors, drones, cameras, medical instruments and other electronic equipment.The combination of its reliable design and maximum cooling potential make it a perfect choice for improving the thermal performance of these components.

Design

This heat sink is manufactured using a combination of thermally conductive aluminum fins, which act as very efficient heat exchangers. The fins are joined together using a lightweight alloy frame, that not only enhances the structural stability but also maximizes air transfer at the same time. This combination helps provide a greater cooling efficiency and can improve the thermal performance of delicate electronic components. The design of the AER53-53-12CB/A01 also features an increased fin radius, helping to reduce the potential for damaging pressure concentrations.

Working Principle

Heat sinks work by transferring heat away from the electronic components, drawing it away from the equipment and spreading it more effectively throughout the environment. This heat sink utilizes a combination of specific design features, along with air transfer, to achieve maximum cooling potential. The design of the aluminum fins essentially creates a radiator to quickly and effectively disperse heat, while the lightweight alloy frame helps protect the fins from damage caused by excessive pressure concentrations. This combination helps extracts heat and reduces the potential for damaging hot spots.

Conclusion

The AER53-53-12CB/A01 heat sink is a reliable and efficient thermal management tool, designed to improve the performance of sensitive electronic components. It works effectively over a wide temperature range, providing excellent cooling potential through thermal conductivity, air transfer, and a lightweight alloy frame. This product is ideal for use in a variety of applications, such as high power electronic components, medical instruments, and drones.

The specific data is subject to PDF, and the above content is for reference

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