AER53-53-21CB/A01

Series:	AER
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Fins
Length:	2.087" (53.02mm)
Width:	2.087" (53.02mm)
Diameter:	--
Height Off Base (Height of Fin):	0.811" (20.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	--
Thermal Resistance @ Natural:	--
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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Introduction

The AER53-53-21CB/A01 is a thermal-heat sink, or a device that allows for the dissipation of heat generated by electronic components. This device works by increasing the surface area for efficient cooling and dispersing the excess heat through an external environment. Heat sinks have traditionally been used for electrical components such as resistors, transistors, LEDs, and integrated circuits and can be found inside many consumer electronics. Heat sinks allow for improved performance and increased lifespan of components, making them an essential part of any electronics application.

Design and Construction

The AER 53-53-21CB/A01 is a two-piece aluminum heat sink constructed of stamped OR aluminum fins with a black DEPS (Dynamic Energy Per Second) coating for optimal heat dissipation. The fins are spaced .25-inches apart in a "pin-and-groove" design to increase the surface area for efficient cooling. The top portion of the heat sink is a cone-shaped structure with a contact plate that attaches firmly to a heatsink\'s component or substrate. The bottom part of the design is an elongated flat base. The contact plate is designed to fit securely on the circuit board of the component or substrate without any vibration. The fins and base are sealed with a black anodized aluminum secondary sealant for thermal and electrical insulation of the component or substrate.

Application Field

The AER 53-53-21CB/A01 is primarily designed for use in consumer electronics components, such as microprocessors, transistors, LEDs, and resistors. The heat sink can also be used in industrial applications, such as in engines or motors, where additional heat dissipation is required. The cooling properties provided by the device allow for improved performance and increased longevity of components. The heat sinks also reduce the chances of electrical overheating, as well as fire hazards caused by electrical components. The device can also reduce power consumption when used with an external fan.

Working Principle

The basic working principle of the AER 53-53-21CB/A01 is the transfer of heat from the component or substrate to the external environment. Heat from the electronics component is transferred to the fins of the heat sink where it is dissipated. The fins of the heat sink provide a large surface area for efficient cooling as heat is passed from the fins, through the base, and into the surrounding environment. The black DEPS coating provides optimal heat dissipation and the secondary sealant on the fins and base ensure thermal and electrical insulation of the component or substrate. The design of the contact plate ensures that the heat sink is securely fastened to the board. The large surface area of the device increases the efficiency of heat dissipation and allows components to run cooler, extending their lifespan.

Conclusion

The AER 53-53-21CB/A01 is a durable and efficient device designed for dispersing heat from electronics components and improving their performance and lifespan. The two-piece design and "pin-and-groove" configuration of the fins increases the heat sink’s surface area for efficient cooling, while the secondary sealant provides thermal and electrical insulation. The device is useful in consumer electronics, industrial applications, and as an additional form of cooling when used with an external fan.

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