AER50-50-18CB/A01

Series:	AER
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Fins
Length:	1.953" (49.60mm)
Width:	1.953" (49.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.693" (17.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.12°C/W @ 200 LFM
Thermal Resistance @ Natural:	7.56°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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AER50-50-18CB/A01 Thermal - Heat Sinks

Heat sinks are devices designed to transfer heat away from critical components and into the surrounding environment. Heat sinks are typically used to reduce the temperatures of integrated circuit (IC) chips through effective thermal management, and are required for any electronic system that requires effective cooling. AER50-50-18CB/A01 thermal – heat sinks are a type of device with a specific application and working principle.The AER50-50-18CB/A01 thermal – heat sinks are a unique device designed to provide efficient cooling for assemblies located inside of an enclosure or mounted on a printed circuit board (PCB). This type of heat sink provides a larger effective area for heat dissipation, greater flexibility, and improved cooling efficiency which allows the device to dissipate heat more efficiently. This device consists of a cavity that is lined with fins, which act as a heat-transfer medium, and a fan, which is used to increase the cooling rate.The AER50-50-18CB/A01 thermal – heat sink is designed to work in a variety of confined spaces. The fan is used to move air through the cavity and across the fins, which transfers the heat away from the device into the surrounding environment. The fan’s rotation causes air to be drawn into the device and then expelled, which allows the required amount of cooling to be achieved. Additionally, the air capture size of the AER50-50-18CB/A01 thermal – heat sink is designed to be large enough to ensure that a sufficient amount of air is drawn into the device in order to effectively dissipate the heat from critical components.The AER50-50-18CB/A01 thermal – heat sink is designed to work with a wide range of other devices. It is typically used in combination with cooling fans, heat pipes, and thermo-electric coolers (TECs). This allows the required cooling to be achieved with maximum efficiency. Additionally, the AER50-50-18CB/A01 thermal – heat sink has been designed to work with a variety of materials, including metal and plastic. This allows the device to be used in a range of confined spaces and environments, making it an ideal cooling solution for a variety of applications.In order to ensure maximum efficiency, the AER50-50-18CB/A01 thermal – heat sink requires an efficient and properly sized cooling system. This is because the device is designed to work in conjunction with fans and other thermal solutions. An effective cooling system enables the device to efficiently transfer heat away from the critical components. Additionally, a properly sized cooling system is essential to ensure that the device can operate efficiently, as it will be able to dissipate the necessary amount of heat in a timely manner.The AER50-50-18CB/A01 thermal – heat sink is an effective and efficient cooling solution for a variety of electronic configurations. The device effectively and efficiently transfers heat away from critical components, allowing them to operate at lower temperatures. Additionally, the device is capable of providing an effective and efficient cooling solution when combined with other cooling solutions. This makes it an ideal choice for applications requiring efficient cooling.

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