Allicdata Part #: | AER53-53-23CB/A01-ND |
Manufacturer Part#: |
AER53-53-23CB/A01 |
Price: | $ 8.88 |
Product Category: | Fans, Thermal Management |
Manufacturer: | CTS Thermal Management Products |
Short Description: | HEATSINK FORGED BLK ANO TOP MNT |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | AER53-53-23CB/A01 Datasheet/PDF |
Quantity: | 1000 |
100 +: | $ 7.99575 |
Specifications
Series: | AER |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Fins |
Length: | 2.087" (53.02mm) |
Width: | 2.087" (53.02mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.890" (22.61mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | -- |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum Alloy |
Material Finish: | Black Anodized |
Description
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
AER53-53-23CB/A01 Thermal and Heat Sinks Applications and Working Principles
Thermal and heat sinks are powerful tools for maintaining energy efficiency and keeping all types of electronics cool. The AER53-53-23CB/A01, is a finned heat sink designed to effectively dissipate heat, produced by microchips and other electronics, and keep them from experiencing overheating. Below, provides a deeper understanding about how this type of heat sink works and discusses its applications.The Working Principles of Heat Sinks
A heat sink is a device used to dissipate heat away from a hot piece of electronics or from a hot spot. It is an integral part of any electrical or electronic system as it prevents components from overheating, reducing the risk of failure or short circuiting. Heat sinks are used in a variety of applications, from cooling microchips and computer CPUs to aircraft turbine engines.The AER53-53-23CB/A01 is a type of finned heat sink, which utilizes a radiator, or “fins”, in order to help transfer the heat generated from a system into the environment. The fins are arranged in an organized pattern to maximize the surface area exposed to the environment. This therefore maximizes the amount of heat that can be taken away by the heat sink, resulting in an efficient dissipation of heat energy. The finned heat sink is composed of two components: a radiator and a fan. The fan operates mechanically and helps move heat away from the electronics. Heat is drawn away from the components and dispersed into the surrounding environment. Additionally, a thermally conductive material such as aluminum is used to draw the heat away from the components and into the fins, where it can then be transferred.Applications of Heat Sinks
The AER53-53-23CB/A01 is an efficient finned heat sink suitable for a variety of applications where components are at risk of overheating. It is often used for cooling electronics which tend to generate large amounts of heat. Some of the common applications of this type of heat sink include cooling CPUs for computers, audio equipment and other consumer electronics.The AER53-53-23CB/A01 heat sink also finds many applications in industrial and commercial settings such as factories and warehouses. It is often used to cool power supplies, motors, transformers and other pieces of industrial equipment. The heat sink is also used to cool laser diodes for telecommunications and navigation systems.The AER53-53-23CB/A01 is a reliable and efficient finned heat sink designed to provide efficient cooling solutions. It is ideal for cooling components and other electronic devices which tend to get too hot. The heat sink utilizes a fan to help draw the heat away from the components and into the environment. Additionally the fins maximize the surface area exposed to the surrounding environment, helping to dissipate the heat more efficiently. Its versatility and efficiency has made it an ideal choice for a variety of applications.The specific data is subject to PDF, and the above content is for reference
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