AS4C64M16D3-12BCNTR

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AS4C64M16D3-12BCNTR is a type of memory chip from the company Alliance Memory that has a wide range of applications in various industries and conditions. The module is an asynchronous, wide-temperature-range, low-power static random access memory (SRAM). It provides high-density, high-speed, and low-power memory solutions for applications where space is limited.

The AS4C64M16D3-12BCNTR chip has an operating temperature range of -40°C to +85°C. It is also capable of sustaining operations in extreme conditions and still providing stable operations. This makes it ideal for use in various applications that span a wide range of temperatures. Its wide temperature range also makes it ideal for use in industrial, automotive, and avionics. In such applications, the chip will provide consistently reliable operations even in the harshest of conditions.

The AS4C64M16D3-12BCNTR module has a PC board layout that is optimized for high density. Its high-density, feature-rich design ensures greater flexibility during the design and prototyping of a system. The chip uses a unique memory architecture specifically designed to provide easy-to-use features such as write protection, edge-triggered interrupts, and multiple banks of SRAM. This reduces design time and accelerates time to market.

The module also has a wide range of powering options and a low-power design that helps to conserve energy. At full-power dissipation, this chip requires only 320mW of power to run, allowing for up to a 20% power savings over similar SRAM chips. In addition, the chip has a multiple power-down mode, allowing for up to a 40% power savings over similar SRAM chips.

The AS4C64M16D3-12BCNTR chip provides a unique feature that allows it to comply with the low-power requirements needed for various types of applications, such as battery-backed products, automotive systems, handheld devices, game consoles, and wireless modules. This is achieved by enabling external programming and access via SPI bus, I/O ports and memory characteristics flexibility.

The AS4C64M16D3-12BCNTR chip is built using the latest static logic process technology that provides very low power dissipation, low pin count and small board footprint. It is a single-chip solution that implements most of the memory requirements for a given application. This gives the system designer the freedom to design a system that requires very little external components and support peripherals, as well as better performance in terms of low power consumption. The chip is also flexible, as it supports multiple operating modes including burst and continuous access.

In conclusion, the AS4C64M16D3-12BCNTR chip from Alliance Memory is an excellent memory solution for applications that require wide temperature ranges and low-power operation. It is an ideal solution for industrial, automotive, and avionics applications and provides high-density, high-speed, and low-power memory solutions in even the most extreme of conditions. It is a single-chip solution that implements most of the memory requirements for a given application and can provide significant power savings while providing reliable operations.

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