AS4C64M16MD2-25BCN Allicdata Electronics
Allicdata Part #:

1450-1412-ND

Manufacturer Part#:

AS4C64M16MD2-25BCN

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Alliance Memory, Inc.
Short Description: IC DRAM 1G PARALLEL 134FBGA
More Detail: SDRAM - Mobile LPDDR2 Memory IC 1Gb (64M x 16) Par...
DataSheet: AS4C64M16MD2-25BCN datasheetAS4C64M16MD2-25BCN Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tray 
Part Status: Obsolete
Memory Type: Volatile
Memory Format: DRAM
Technology: SDRAM - Mobile LPDDR2
Memory Size: 1Gb (64M x 16)
Clock Frequency: 400MHz
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Voltage - Supply: 1.14 V ~ 1.95 V
Operating Temperature: -30°C ~ 85°C (TC)
Mounting Type: Surface Mount
Package / Case: 134-VFBGA
Supplier Device Package: 134-FBGA (10x11.5)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The AS4C64M16MD2-25BCN memory module is part of a family of low-power, low-voltage memory devices, featuring one of the most advanced configurations available today. The module has a wide range of applications, ranging from consumer electronics to industrial applications. This includes embedded systems, communications, audio and video applications, and many more.

The AS4C64M16MD2-25BCN memory features an advanced 16 bits organization, with a 2-bit chip select and a 25ns access time. This ensures maximum performance with low power consumption. Additionally, the module has an industry standard configuration and an integrated ROM EPROM controller, which enables easy replacement when upgrading or replacing memory chips. Furthermore, the module is designed with a thermal sensing system, which allows it to prevent possible data loss due to overheating.

The AS4C64M16MD2-25BCN memory module is a DDR3 module built with Advanced Semiconductor’s proprietary fabrication processes. This provides top-level performance, with improved performance and reliability for applications in embedded systems, audio and video applications, communications, and many more. This module also offers superior thermal performance, providing high-speed data transfer with less heat being generated. Additionally, the low-power operation of the DDR3 module reduces overall power consumption.

The working principle of the AS4C64M16MD2-25BCN memory module is based on an integrated circuit configuration. This complex configuration consists of a clock generator, synchronous memory controllers, an address multiplexer, an I/O system, and a register file. The integrated circuit is designed to ensure maximum performance and reliability for applications needing the most complex memory configurations. It also supports the most advanced data transfer operations.

To ensure maximum performance and reliability, the AS4C64M16MD2-25BCN is designed with self-diagnostics and built-in error correction and detection. This helps to protect data integrity in a wide range of industrial, commercial, and consumer applications. Additionally, the module features a unique fail-safe mechanism. This mechanism automatically detects and corrects errors that occur during the normal operation of the device. It also helps to maintain the quality of memory data even during the most extreme operating conditions.

AS4C64M16MD2-25BCN memory module is an ideal choice for a wide range of applications, including industrial, communications, embedded systems, audio and video, and many more. The advanced integrated circuit configuration and low-power operation make it a perfect memory solution for a variety of devices. The manual diagnostics and built-in error correction and detection further ensure reliable operation. Finally, the integrated thermal sensing system helps to protect data integrity even during extreme operating conditions.

The specific data is subject to PDF, and the above content is for reference

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