BSF053N03LT G Allicdata Electronics
Allicdata Part #:

BSF053N03LTG-ND

Manufacturer Part#:

BSF053N03LT G

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: Infineon Technologies
Short Description: MOSFET N-CH 30V 71A 2WDSON
More Detail: N-Channel 30V 16A (Ta), 71A (Tc) 2.2W (Ta), 42W (T...
DataSheet: BSF053N03LT G datasheetBSF053N03LT G Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Vgs(th) (Max) @ Id: 2.2V @ 250µA
Package / Case: 3-WDSON
Supplier Device Package: MG-WDSON-2, CanPAK M™
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Power Dissipation (Max): 2.2W (Ta), 42W (Tc)
FET Feature: --
Input Capacitance (Ciss) (Max) @ Vds: 2700pF @ 15V
Vgs (Max): ±20V
Gate Charge (Qg) (Max) @ Vgs: 29nC @ 10V
Series: OptiMOS™
Rds On (Max) @ Id, Vgs: 5.3 mOhm @ 30A, 10V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Current - Continuous Drain (Id) @ 25°C: 16A (Ta), 71A (Tc)
Drain to Source Voltage (Vdss): 30V
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Obsolete
Packaging: Tape & Reel (TR) 
Description

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BSF053N03LT G is a silicon carbide (SiC) MOSFET with low drain-source on-resistance. It has a gate charge of maximum 14.4 nC and maximum 0.93 µC drain-source on-resistance at V GS = 10 V. It is designed for high frequency applications and power converters, such as DC-DC converters, AC-DC rectifiers, and resonant converters.

The working principle of BSF053N03LT G is a combination of electron tunneling and electrostatic attraction. When a voltage is applied to the gate, an electric field is generated, which causes electrons to move from the gate to the source or drain area. This creates a conducting layer between the source and drain, which alters the resistance of the device. The gate voltage is then used to adjust the amount of current flowing through the device.

This low-drain-source on-resistance silicon carbide (SiC) MOSFET can be used in a variety of applications. It is particularly suitable for high power, high efficiency applications where a low gate charge, low gate voltage, and minimum losses are required. Potential applications include: RF power amplifiers in mobile communication systems, DC-DC converters, AC-DC rectifiers, flyback converters, and resonant converters.

The structure of BSF053N03LT G is similar to that of a metal-oxide-semiconductor field-effect transistor (MOSFET). The main difference between the two is that the silicon carbide SiC layer in BSF053N03LT G provides a reduced internal resistance, compared to Silicon MOSFET. This lower resistance in turn provides lower capacitance, which enables the device to operate at higher frequencies with expected output time responses.

The structure of BSF053N03LT G consists of a P-type semiconducting channel and a planar gate electrode. The gate electrode is formed by depositing a metal either directly on or in the channel. When a voltage is applied to the gate, the electrons are repelled and the device is pulled in one direction. As a result, the current flowing through the device is reduced.

Overall, BSF053N03LT G is an excellent choice for high frequency applications and power converters. It offers low gate charge, low gate voltage, and minimum losses, making it suitable for a variety of applications such as RF power amplifiers in mobile communication systems, DC-DC converters, AC-DC rectifiers, flyback converters, and resonant converters. While the working principle utilizes a combination of electron tunneling and electrostatic attraction, the structure of the MOSFET is similar to that of a metal-oxide-semiconductor field-effect transistor (MOSFET). This makes it easy to switch and provides for great control over the flow of current through the device.

The specific data is subject to PDF, and the above content is for reference

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