IPD144N06NGBTMA1 Discrete Semiconductor Products |
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Allicdata Part #: | IPD144N06NGBTMA1TR-ND |
Manufacturer Part#: |
IPD144N06NGBTMA1 |
Price: | $ 0.00 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | Infineon Technologies |
Short Description: | MOSFET N-CH 60V 50A TO-252 |
More Detail: | N-Channel 60V 50A (Tc) 136W (Tc) Surface Mount PG-... |
DataSheet: | IPD144N06NGBTMA1 Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | OptiMOS™ |
Packaging: | Tape & Reel (TR) |
Part Status: | Obsolete |
FET Type: | N-Channel |
Technology: | MOSFET (Metal Oxide) |
Drain to Source Voltage (Vdss): | 60V |
Current - Continuous Drain (Id) @ 25°C: | 50A (Tc) |
Drive Voltage (Max Rds On, Min Rds On): | 10V |
Rds On (Max) @ Id, Vgs: | 14.4 mOhm @ 50A, 10V |
Vgs(th) (Max) @ Id: | 4V @ 80µA |
Gate Charge (Qg) (Max) @ Vgs: | 54nC @ 10V |
Vgs (Max): | ±20V |
Input Capacitance (Ciss) (Max) @ Vds: | 1900pF @ 30V |
FET Feature: | -- |
Power Dissipation (Max): | 136W (Tc) |
Operating Temperature: | -55°C ~ 175°C (TJ) |
Mounting Type: | Surface Mount |
Supplier Device Package: | PG-TO252-3 |
Package / Case: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
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The IPD144N06NGBTMA1 is a type of single-cell wide-bandgap semiconductor that is used in many different applications including higher speed 10 Gigabit Ethernet and Fiber optic communications, power conversion monitoring, electrostatic discharge protection, and other projects. In this article, we\'ll be taking a look at the application fields and working principles of the IPD144N06NGBTMA1.
Application Fields of the IPD144N06NGBTMA1
This single-cell wide-bandgap semiconductor features a high-power density and low-voltage operation. It is widely used in many different applications and is suitable for projects where high switching speeds, low-power consumption, and high endurance are required. It is mainly used in higher speed 10 Gigabit Ethernet and Fiber optic communications, where the semiconductor can support a bit rate of 10 Gigabits per second and is capable of operating at up to 4GHz. It\'s also widely used in power conversion monitoring and Electrostatic Discharge (ESD) protection projects. Additionally, the semiconductor offers low-resistance and fast switching performance, making it ideal for high-frequency AC/DC power conversion applications.
Working Principle of the IPD144N06NGBTMA1
The IPD144N06NGBTMA1 is based on GaN technology, which means it is constructed from Gallium Nitride (GaN) and provides superior performance, efficiency, and power density compared to traditional Silicon-based semiconductors. This type of wide-bandgap semiconductor features a number of key features, including, but not limited to, low losses under gate-driving, fast switching speed, low threshold voltage, and high-power efficiency. Additionally, it provides a high breakdown voltage of approximately 600V and can operate within an operating voltage range of -1.8V to 12V.
At the heart of the IPD144N06NGBTMA1 is an N-channel enhancement-mode MOSFET, which is composed of two distinct parts: the gate and the drain. The gate is responsible for regulating the flow of current through the device by controlling the conductivity of the channel and is typically metal. The drain is the other component of an enhancement MOSFET and is constructed from an N-type semiconductor material, such as silicon or gallium nitride. It is responsible for carrying the majority of the current and also serves as the entry point for control signals from the gate.
The IPD144N06NGBTMA1 also features a number of safety mechanisms, such as overcurrent and over-voltage protection, which are designed to offers high reliability and stability. Additionally, this model has the added benefit of being able to operate in extreme environmental conditions, including high temperatures and humidity.
Conclusion
The IPD144N06NGBTMA1 is a type of single-cell wide-bandgap semiconductor that is used in many different applications including higher speed 10 Gigabit Ethernet and Fiber optic communications, power conversion monitoring, electrostatic discharge protection, and more. It is based on Gallium Nitride (GaN) technology and offers superior performance, efficiency, and power density compared to traditional Silicon-based semiconductors. Additionally, this type of MOSFET is composed of two distinct parts: the gate and the drain and features safety mechanisms that ensure high reliability and stability.
The specific data is subject to PDF, and the above content is for reference
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