Allicdata Part #: | MT53B256M64D2NL-062XTES:C-ND |
Manufacturer Part#: |
MT53B256M64D2NL-062 XT ES:C |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Micron Technology Inc. |
Short Description: | IC DRAM 16G 1600MHZ FBGA |
More Detail: | SDRAM - Mobile LPDDR4 Memory IC 16Gb (256M x 64) ... |
DataSheet: | MT53B256M64D2NL-062 XT ES:C Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Part Status: | Obsolete |
Memory Type: | Volatile |
Memory Format: | DRAM |
Technology: | SDRAM - Mobile LPDDR4 |
Memory Size: | 16Gb (256M x 64) |
Clock Frequency: | 1600MHz |
Write Cycle Time - Word, Page: | -- |
Memory Interface: | -- |
Voltage - Supply: | 1.1V |
Operating Temperature: | -30°C ~ 105°C (TC) |
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Memory is a crucial part of any computing system. It provides the building blocks for a computer to store instructions, data, and programs for future use. The MT53B256M64D2NL-062 XT ES:C is a type of dynamic random access memory (DRAM) used in a variety of computing applications. This article will discuss the application fields and working principles of the MT53B256M64D2NL-062 XT ES:C memory module.
The MT53B256M64D2NL-062 XT ES:C is a 256Mb DDR3 double data rate (DDR3) certified memory module. It has a data transfer rate of 1600 MT/s and a power consumption of 1.5V. It features an on-die termination (ODT) scheme and supports a maximum of 16 device dies. It is optimized to deliver maximum memory performance with low power consumption.
The MT53B256M64D2NL-062 XT ES:C memory module has applications in various computing platforms, from embedded devices to high-end servers. It is a compatible memory module for a variety of systems, including laptops, desktops, server platforms, and gaming consoles. It is also used in artificial intelligence (AI) and machine learning (ML) applications.
The MT53B256M64D2NL-062 XT ES:C memory module works on a DDR3 double data rate protocol. This means that data transfers on the memory module are performed at a double rate of the system clock rate. This allows for double the data transfer rate, as compared to SDRAM. The module is based on a stacking technology which optimizes signal integrity and reduces power consumption.
The MT53B256M64D2NL-062 XT ES:C memory module has an on-die termination (ODT) scheme. This prevents signal reflections on the system bus, which can reduce memory performance. The ODT scheme also supports multiple system configurations and dynamically adjusts the on-die termination levels to matched memory configurations.
The MT53B256M64D2NL-062 XT ES:C memory module also supports ECC error correction. ECC is a technique for detecting and correcting errors in data stored in memory. It works by adding extra bits of information to each memory cell, which are then used to detect and correct errors. This ensures data integrity and helps maintain system reliability.
The MT53B256M64D2NL-062 XT ES:C memory module is designed to work with Intel\'s XMP (Extreme Memory Profile) and AMR (Active Memory Re-timing). XMP allows for higher overclocking of the system and AMR dynamically optimizes the memory timings to deliver optimal performance.
The MT53B256M64D2NL-062 XT ES:C memory module is a versatile memory module that is suitable for a variety of computing applications. Its DDR3 protocol allows for double the data transfer rate, and its ODT scheme and ECC support provide maximum memory performance and reliability. The module also supports Intel\'s XMP and AMR, enabling optimal system performance.
The specific data is subject to PDF, and the above content is for reference
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