MT53D1G32D4NQ-046 WT ES:E TR Allicdata Electronics
Allicdata Part #:

MT53D1G32D4NQ-046WTES:ETR-ND

Manufacturer Part#:

MT53D1G32D4NQ-046 WT ES:E TR

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Micron Technology Inc.
Short Description: LPDDR4 32G 512MX64 FBGA QDP
More Detail: Memory IC
DataSheet: MT53D1G32D4NQ-046 WT ES:E TR datasheetMT53D1G32D4NQ-046 WT ES:E TR Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: *
Packaging: Tape & Reel (TR) 
Part Status: Active
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Memory

MT53D1G32D4NQ-046 WT ES:E TR is a type of memory that has been developed as a solution to the growing demand for faster, higher-capacity storage needs. The memory is ideal for use in applications that require both speed and high-density data storage. It offers a cost-effective solution for data-intensive applications.

MT53D1G32D4NQ-046 WT ES:E TR is a non-volatile type of random access memory (RAM) which uses high-density, high-speed DRAM chips. The DRAM chips used for this memory are of an advanced design and provide superior performance compared to traditional RAM. The data stored in the chips is stored in a non-volatile state, which means that it will remain intact even when the power is turned off. This makes the memory extremely reliable and well suited for data-intensive applications.

This type of memory is typically used in server applications, where speed and high data storage capacity are essential. It is also well suited for applications such as gaming and multimedia applications, which require rapid data access. The memory has also been used in high-performance embedded applications such as communications and industrial control systems.

As far as the working principle of the memory is concerned, MT53D1G32D4NQ-046 WT ES:E TR memory works by allowing data to be written and read in an efficient and orderly fashion. All the DRAM chips are placed on a board and connected together with a bus that allows data transfer between them. Data is written and read to and from the DRAM chips using a controller. The controller determines the address for the data and controls the timing of the read and write operations.

The memory is designed to offer maximum speed, low latency and maximum storage density. The controller also ensures that the data is written and read efficiently and in the correct order. This memory is designed to support high throughput, low latency and maximum density in order to meet the highest performance requirements.

The MT53D1G32D4NQ-046 WT ES:E TR memory also provides error correction features, which helps to reduce the chances of data loss due to errors in the data. It also helps to minimize interference from other components in the system and can be used in high-performance applications where interference may be a factor.

Overall, the MT53D1G32D4NQ-046 WT ES:E TR memory is designed to offer high-speed and high-density data storage solutions for mission critical applications. It is well suited for applications where speed and reliability are paramount, and is an ideal solution for data-intensive applications. Despite the advanced design and features, the memory is still cost-effective and offers an excellent return on investment.

The specific data is subject to PDF, and the above content is for reference

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