Dsp microcontroller core - Allicdata Electronics

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Allicdata Part#	Mft.Part#	Company	Spec.	QTY.	Pricing(USD)
MPC8314CVRAGDA- ND	MPC8314CVRAGDA	NXP USA Inc	View more Series: MPC83xx Packaging: Tray Part Status: Active Core Processor: PowerPC e300c3 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40C ~ 105C (TA) Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29) Additional Interfaces: DUART, HSSI, IC, PCI, SPI, TDM Base Part Number: MPC8314	72 Order	--
MC7447ATHX1000N B-ND	MC7447ATHX1000N B	NXP USA Inc	View more Series: MPC74xx Packaging: Tray Part Status: Not For New Designs Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage - I/O: 1.8V, 2.5V Operating Temperature: -40C ~ 105C (TA) Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25) Base Part Number: MC7447	1000 Order	44+: $233.883
MC7447AHX1000LB -ND	MC7447AHX1000LB	NXP USA Inc	View more Series: MPC74xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage - I/O: 1.8V, 2.5V Operating Temperature: 0C ~ 105C (TA) Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25) Base Part Number: MC7447	1000 Order	1+: $0
MPC8555VTAJD-ND	MPC8555VTAJD	NXP USA Inc	View more Series: MPC85xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (2) USB: USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Additional Interfaces: DUART, IC, PCI, SPI, TDM, UART Base Part Number: MPC8555	1000 Order	1+: $0
MC7448VS1420LD- ND	MC7448VS1420LD	NXP USA Inc	View more Series: MPC74xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.42GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0C ~ 105C (TA) Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25) Base Part Number: MC7448	1000 Order	1+: $0
MPC8572LVTATLD- ND	MPC8572LVTATLD	NXP USA Inc	View more Series: MPC85xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (4) Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33) Additional Interfaces: DUART, HSSI, IC, RapidIO Base Part Number: MPC8572	1000 Order	1+: $0
MPC8544DVTALFA- ND	MPC8544DVTALFA	NXP USA Inc	View more Series: MPC85xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Additional Interfaces: DUART, IC, PCI Base Part Number: MPC8544	1000 Order	1+: $0
MPC8544DVTANGA- ND	MPC8544DVTANGA	NXP USA Inc	View more Series: MPC85xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Additional Interfaces: DUART, IC, PCI Base Part Number: MPC8544	1000 Order	1+: $0
MPC8544VTAQGA-N D	MPC8544VTAQGA	NXP USA Inc	View more Series: MPC85xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Additional Interfaces: DUART, IC, PCI Base Part Number: MPC8544	1000 Order	1+: $0
P2020NXN2HHC-ND	P2020NXN2HHC	NXP USA Inc	View more Series: QorIQ P2 Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (3) USB: USB 2.0 + PHY (2) Operating Temperature: -40C ~ 125C (TA) Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31) Additional Interfaces: DUART, IC, MMC/SD, SPI Base Part Number: P2010	1000 Order	1+: $0
MPC8547VTAQGD-N D	MPC8547VTAQGD	NXP USA Inc	View more Series: MPC85xx Packaging: Tray Part Status: Obsolete Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Ethernet: 10/100/1000 Mbps (4) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0C ~ 105C (TA) Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Additional Interfaces: DUART, IC, PCI, RapidIO Base Part Number: MPC8547	1000 Order	1+: $0
SP5745CFK1AMKU6 R-ND	SP5745CFK1AMKU6 R	NXP USA Inc	View more Series: MPC57xx Part Status: Active Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, IC, LINbus, SPI Peripherals: DMA, IS, POR, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA)	1000 Order	500+: $11.9021
SP5745CBK1AMMJ6 R-ND	SP5745CBK1AMMJ6 R	NXP USA Inc	View more Series: MPC57xx Part Status: Active Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, IC, LINbus, SPI Peripherals: DMA, IS, POR, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA)	1000 Order	1000+: $13.3561
SP5744CBK1AVKU6 R-ND	SP5744CBK1AVKU6 R	NXP USA Inc	View more Series: MPC57xx Part Status: Active Core Processor: e200z2, e200z4 Core Size: 32-Bit Dual-Core Speed: 80MHz, 160MHz Connectivity: CANbus, Ethernet, FlexRay, IC, LINbus, SPI Peripherals: DMA, IS, POR, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 36x10b, 16x12b Oscillator Type: Internal Operating Temperature: -40C ~ 105C (TA)	1000 Order	500+: $11.4848
8995202021-ND	8995202021	Fair-Rite Products Corp.	View more Series: * Part Status: Active Core Type: EFD Tolerance: 25% Gap: Ungapped Initial Permeability (i): 3000 Material: 95 Core Factor (I/A) mm1: 156 Effective Length (le) mm: 47.4 Effective Area (Ae) mm: 31 Minimum Core Cross Section (Amin) mm: 29 Effective Magnetic Volume (Ve) mm: 1440 Finish: Uncoated	1000 Order	1120+: $0.1908
598-2441-ND	CRD-49844	Cirrus Logic Inc.	View more Part Status: Active Type: Audio Function: Audio Processing Embedded: Yes, DSP Utilized IC / Part: CS49844 Supplied Contents: Board(s)	7 Order	1+: $211.68
598-2442-ND	DC49844	Cirrus Logic Inc.	View more Part Status: Active Type: Audio Function: Audio Processing Embedded: Yes, DSP Utilized IC / Part: CS49844 Supplied Contents: Board(s)	4 Order	1+: $78.75
598-2440-ND	CRD-49834	Cirrus Logic Inc.	View more Part Status: Active Type: Audio Function: Audio Processing Embedded: Yes, DSP Utilized IC / Part: CS49834 Supplied Contents: Board(s)	4 Order	1+: $211.68
CRD48DV2-USB-ND	CRD48DV2-USB	Cirrus Logic Inc.	View more Part Status: Not For New Designs Type: Audio Function: Audio Processing Embedded: Yes, DSP Utilized IC / Part: CS48DV2 Supplied Contents: Board(s)	1000 Order	1+: $157.5
SA3229-E1-T-ND	SA3229-E1-T	ON Semiconductor	View more Part Status: Active Type: Audio Interface: IC, SDA Clock Rate: 375MHz Operating Temperature: 0C ~ 40C (TA)	1000 Order	250+: $19.404
497-8917-ND	STM32F105VCT6	STMicroelectronics	View more Series: STM32F1 Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M3 Core Size: 32-Bit Speed: 72MHz Controller Series: ARM Microcontrollers - MCU Connectivity: CANbus, IC, IrDA, LINbus, SPI, UART/USART, USB OTG Peripherals: DMA, POR, PWM, Voltage Detect, WDT Interface: ICSPIUSB Number of I/O: 80 Program Memory Size: 256KB (256K x 8) Voltage - Supply: 2 V ~ 3.6 V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V Data Converters: A/D 16x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 100-LQFP Base Part Number: STM32F105	17930 Order	--
S9S12GN32AMLF-N D	S9S12GN32AMLF	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Controller Series: Microcontrollers - MCU Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Voltage - Supply: 3.13 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 1K x 8 Mounting Type: Surface Mount RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: S9S12	33520 Order	--
S9S12G128AMLF-N D	S9S12G128AMLF	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Controller Series: Microcontrollers - MCU Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: SCI, SPI Number of I/O: 40 Program Memory Size: 128KB (128K x 8) Voltage - Supply: -40C ~ 125C Program Memory Type: FLASH EEPROM Size: 4K x 8 Mounting Type: Surface Mount RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7) Base Part Number: S9S12	22680 Order	--
S9S12G64AMLH-ND	S9S12G64AMLH	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Controller Series: 16-bit Microcontrollers - MCU Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: SCI, SPI Number of I/O: 54 Program Memory Size: 64KB (64K x 8) Voltage - Supply: 3.13 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 2K x 8 Mounting Type: Surface Mount RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: S9S12	17550 Order	--
FS32K144HRT0MLH T-ND	FS32K144HRT0MLH T	NXP USA Inc	View more Series: S32K Packaging: Tray Part Status: Active Core Processor: ARM Cortex-M4F Core Size: 32-Bit Speed: 80MHz Controller Series: ARM Microcontrollers - MCU Connectivity: CANbus, FlexIO, IC, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Interface: I2C, I2S, LIN Number of I/O: 58 Program Memory Size: 512KB (512K x 8) Voltage - Supply: 2.7 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 4K x 8 Mounting Type: Surface Mount RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: FS32K144	11725 Order	--
S9S12G128AMLHR- ND	S9S12G128AMLHR	NXP USA Inc	View more Series: HCS12 Packaging: Tape & Reel (TR) Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Controller Series: Microcontrollers - MCU Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: SCI, SPI Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Voltage - Supply: 3.13 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 4K x 8 Mounting Type: Surface Mount RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10) Base Part Number: S9S12	28741 Order	--
MC908AB32CFUE-N D	MC908AB32CFUE	NXP USA Inc	View more Series: HC08 Packaging: Tray Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Controller Series: 8-bit Microcontrollers - MCU Connectivity: SCI, SPI Peripherals: POR, PWM Interface: SCI, SPI Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Voltage - Supply: 4.5 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 512 x 8 Mounting Type: Surface Mount RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14) Base Part Number: MC908AB32	8610 Order	--
S9S12G128AMLL-N D	S9S12G128AMLL	NXP USA Inc	View more Series: HCS12 Packaging: Tray Part Status: Active Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Controller Series: 16-bit Microcontrollers - MCU Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: SCI, SPI Number of I/O: 86 Program Memory Size: 128KB (128K x 8) Voltage - Supply: 3.13 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 4K x 8 Mounting Type: Surface Mount RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 125C (TA) Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14) Base Part Number: S9S12	450 Order	--
S912XET256W1MAL -ND	S912XET256W1MAL	NXP USA Inc	View more Series: HCS12X Packaging: Tray Part Status: Active Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Controller Series: Microcontrollers - MCU Connectivity: CANbus, EBI/EMI, IC, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: SCI, SPI Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Voltage - Supply: 1.72 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 4K x 8 Mounting Type: Surface Mount RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40C ~ 125C (TA) Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20) Base Part Number: S912	6684 Order	--
S9S08SG16E1CTG- ND	S9S08SG16E1CTG	NXP USA Inc	View more Series: S08 Packaging: Tube Part Status: Active Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Controller Series: Embedded - Microcontrollers Connectivity: IC, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Interface: I2CSCISPI Number of I/O: 12 Program Memory Size: 16KB (16K x 8) Voltage - Supply: -40C ~ 85C (TA) Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP Base Part Number: S9S08SG16	14100 Order	--
MC908MR32CFUE-N D	MC908MR32CFUE	NXP USA Inc	View more Series: HC08 Packaging: Tray Part Status: Not For New Designs Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Controller Series: Microcontrollers - MCU Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Interface: SCI, SPI Number of I/O: 44 Program Memory Size: 32KB (32K x 8) Voltage - Supply: 4.5 V ~ 5.5 V Program Memory Type: FLASH Mounting Type: Surface Mount RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14) Base Part Number: MC908MR32	5229 Order	--
PIC16F690-I/P-N D	PIC16F690-I/P	Microchip Technology	View more Series: PIC 16F Packaging: Tube Part Status: Active Core Processor: PIC Core Size: 8-Bit Speed: 20MHz Controller Series: 8-bit Microcontrollers - MCU Connectivity: IC, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Interface: IC, SPI Number of I/O: 18 Program Memory Size: 7KB (4K x 14) Voltage - Supply: 2 V ~ 5.5 V Program Memory Type: FLASH EEPROM Size: 256 x 8 Mounting Type: Through Hole RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40C ~ 85C (TA) Package / Case: 20-DIP (0.300", 7.62mm) Supplier Device Package: 20-PDIP Base Part Number: PIC16F690	28510 Order	--
ADSP-BF606KBCZ- 4-ND	ADSP-BF606KBCZ- 4	Analog Devices Inc.	View more Series: Blackfin Packaging: Tray Part Status: Active Type: Dual Core Interface: CAN, EBI/EMI, Ethernet, IC, SPI, SPORT, UART/USART, USB OTG Clock Rate: 400MHz Non-Volatile Memory: ROM (64 kB) On-Chip RAM: 552kB Voltage - I/O: 1.8V, 3.3V Voltage - Core: 1.25V Operating Temperature: 0C ~ 70C (TA) Mounting Type: Surface Mount Package / Case: 349-LFBGA, CSPBGA Supplier Device Package: 349-CSPBGA (19x19) Base Part Number: ADSP-BF606	1000 Order	33+: $16.0543
ADSP-BF608KBCZ- 5-ND	ADSP-BF608KBCZ- 5	Analog Devices Inc.	View more Series: Blackfin Packaging: Tray Part Status: Active Type: Dual Core Interface: CAN, EBI/EMI, Ethernet, IC, SPI, SPORT, UART/USART, USB OTG Clock Rate: 500MHz Non-Volatile Memory: ROM (64 kB) On-Chip RAM: 808K x 8 Voltage - I/O: 1.8V, 3.3V Voltage - Core: 1.25V Operating Temperature: 0C ~ 70C Mounting Type: Surface Mount Package / Case: 349-LFBGA, CSPBGA Supplier Device Package: 349-CSPBGA (19x19) Base Part Number: ADSP-BF608	1000 Order	26+: $20.3061
KMC8144TVT1000A -ND	KMC8144TVT1000A	NXP USA Inc	View more Series: StarCore Packaging: Tray Part Status: Obsolete Type: SC3400 Core Interface: EBI/EMI, Ethernet, IC, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: -40C ~ 105C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Base Part Number: MC8144	1000 Order	1+: $0
KMC8144VT1000A- ND	KMC8144VT1000A	NXP USA Inc	View more Series: StarCore Packaging: Tray Part Status: Obsolete Type: SC3400 Core Interface: EBI/EMI, Ethernet, IC, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0C ~ 90C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Base Part Number: MC8144	1000 Order	1+: $0
KMC8144VT800B-N D	KMC8144VT800B	NXP USA Inc	View more Series: StarCore Packaging: Tray Part Status: Obsolete Type: SC3400 Core Interface: EBI/EMI, Ethernet, IC, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA Clock Rate: 800MHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0C ~ 90C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Base Part Number: MC8144	1000 Order	1+: $0
KMC8144SVT1000B -ND	KMC8144SVT1000B	NXP USA Inc	View more Series: StarCore Packaging: Tray Part Status: Obsolete Type: SC3400 Core Interface: EBI/EMI, Ethernet, IC, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA Clock Rate: 1GHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0C ~ 105C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Base Part Number: MC8144	1000 Order	1+: $0
KMC8144VT800A-N D	KMC8144VT800A	NXP USA Inc	View more Series: StarCore Packaging: Tray Part Status: Obsolete Type: SC3400 Core Interface: EBI/EMI, Ethernet, IC, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA Clock Rate: 800MHz Non-Volatile Memory: ROM (96 kB) On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0C ~ 90C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29) Base Part Number: MC8144	1000 Order	1+: $0
ADSP-BF607BBCZ- 5-ND	ADSP-BF607BBCZ- 5	Analog Devices Inc.	View more Series: Blackfin Packaging: Tray Part Status: Active Type: Dual Core Interface: CAN, EBI/EMI, Ethernet, IC, SPI, SPORT, UART/USART, USB OTG Clock Rate: 500MHz Non-Volatile Memory: ROM (64 kB) On-Chip RAM: 808K x 8 Voltage - I/O: 1.8V, 3.3V Voltage - Core: 1.25V Operating Temperature: -40C ~ 85C (TA) Mounting Type: Surface Mount Package / Case: 349-LFBGA, CSPBGA Supplier Device Package: 349-CSPBGA (19x19) Base Part Number: ADSP-BF607	0 RFQ	--

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