This article writes about the thermal management in displays. ...

This article describes the development trends of electronic components industry ...

In the industrial 4.0 era, the shape, size, efficiency and EMI performance of power supply are very important in the equipment with a large amount of data and various sensors. ...

IC chips offer many benefits in industrial automation and robotics, providing a smaller size, low power consumption, improved reliability, and greater functionality. They are used in a variety of applications to minimize complexity and improve performance ...

This article writes about the product packaging ...

Integrated passive devices are nothing new in our industry – they have been around for a long time and are well known. ...

This article describes the ceramic component ...

​ This article briefly introduce how to identify and detect electronic components ...

In the PCBA (Printed Circuit Board Assembly) assembly process, electrostatic protection and ESD (Electrostatic Discharge) management are crucial. This article will introduce the electrostatic protection principles and ESD management measures in PCBA assem ...

This article briefly introduces the five major electronic components。 ...

This article describes the layout and wiring of components ...

In the PCBA (Printed Circuit Board Assembly) design process, thermal management and heat dissipation technology are crucial. This article will introduce the thermal management principles and common heat dissipation technologies in PCBA design to help read ...

In PCBA (Printed Circuit Board Assembly) design, power management and power consumption optimization are key factors to ensure board performance and reliability. This article will introduce the power management principles and power consumption optimizatio ...

PLCs are industrial computer controllers used to automate machinery and equipment in a variety of industries, providing cost effectiveness and flexibility. ...

This article discusses four ways to simplify FPGA power system management, such as choosing the right power supply, organizing the power architecture, utilizing power management tools and choosing appropriate power scheduling. ...

This article describes how to disassemble electronic component ...

This article describes that may future electronic components printed like newspapers ...

In the PCBA (Printed Circuit Board Assembly) manufacturing process, material selection and supply chain management are key links. This article will introduce the principles of material selection and common materials in PCBA manufacturing, as well as the i ...

The PCBA (Printed Circuit Board Assembly) subcontracting labor and material processing mode has been widely used in the electronics manufacturing industry. Due to its advantages of high efficiency, convenience and cost reduction, it has become the mainstr ...

This article describes the SiC power components expand application cost with electric vehicle development ...

This article describes how to disassemble electronic component ...

This article describes the surface components welding points ...

Manual insertion and welding should be first inserted into those components that need to be mechanically fixed,such as the power device radiator,bracket,clip,etc,and then insert the need to weld fixed components. ...

Mitsubishi Chemical and Dow Corning have developed new processes to improve the production yields of 300mm μ-SiC wafers, enabling the manufacture of more, smaller, and faster integrated circuits. ...

SMT PCBA processing, complete machine OEM and electronic product processing are important links in the electronic manufacturing industry. They are interrelated and together constitute the production process of electronic products. This article will compre ...

This article describe several installation-related concepts of electronic components ...

Here are some information about the XC3S200A-5VQG100C IC FPGA 68 I/O 100VQFP Xilinx Inc. product, which will give you a preliminary understanding of this product. If you are interested, you can visit our website for further information or contact us. ...

This article introduces the principles and requirements for electronic product packaging ...

The article explores how to make an water tank water level automatic controller production ...

This article introduces the basic components on the ATX power board. ...

This article introduces how to identify true and fake electronic components ...

Integrated passive devices are nothing new in our industry - they have a long history and are well known. ...

This article describes the characteristics of the industrial-grade wireless bridges. ...

This article briefly introduces the nsertion principle of plug-in electronic components ...

This article introduces A method for detecting resistance components using a multimeter. ...

This article describes the characteristics of the battery management systems. ...

This article briefly introduces the headphones in audio industry facing changes ...

Here are some information about the XC2S15-5TQ144C IC FPGA 86 I/O 144TQFP Xilinx Inc. product, which will give you a preliminary understanding of this product. If you are interested, you can visit our website for further information or contact us. ...

This article describes the characteristics of the wireless MCU new products. ...

This article is about the difference between electronic component plug-ins and patches. ...