10117865-252FSLF

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Memory Connectors are devices typically used to connect two pieces of memory together in a computer, allowing for data transfer between them. Inline Module Sockets are a specific type of memory connector, and the 10117865-252FSLF is an example of one. This article will discuss the specific features and workings of the 10117865-252FSLF inline module socket, with an emphasis on its application field and working principle.

Overview of 10117865-252FSLF Features

The 10117865-252FSLF inline module socket is a memory connector made by Harris Semiconductor. It is a low-profile, through-hole socket, designed for easy insertion of multiple types of memory devices. The socket has a 0.6mm pitch and a current carrying capacity of 0.5A per pin. It is also RoHS-compliant, with its contacts made of a durable gold plating.

The 10117865-252FSLF is a socket for two-sided sockets, and its design makes it suitable for use with a variety of memory modules. This includes SDRAM, DDR SDRAM, and RDRAM memory types. The socket has a 40-pin signal connection, as well as a single ground pin. The contacts are made of a durable gold plating to ensure that the connection is secure. In addition, the socket provides a level of signal integrity that ensures maximum performance from the memory device.

Application Field of 10117865-252FSLF

The 10117865-252FSLF inline module socket is primarily designed for use in data-intensive applications. This makes it suitable for use in servers, workstations, and embedded computing systems. It is also well-suited for use in industrial automation and communication systems. In addition, the socket is suitable for use in a variety of other applications, including medical equipment, military equipment, and consumer electronics.

Due to its low-profile design and durability, the 10117865-252FSLF inline module socket is also suitable for use in space-constrained environments. In these cases, the socket can be used to secure multiple memory modules in a single socket. This allows for greater memory density in smaller spaces, making it an ideal solution for applications that require higher densities of memory.

Working Principle of 10117865-252FSLF

The working principle of the 10117865-252FSLF inline module socket is relatively straightforward. The socket has a 0.6mm pitch and a current carrying capacity of 0.5A per pin, which makes it suitable for use with a variety of memory modules. When a memory module is inserted into the socket, a connection is made between all of the pins. The contacts are then supplied with electricity and data, which allow the memory module to operate correctly.

The socket also provides a level of signal integrity that ensures maximum performance from the memory device. This is accomplished through the use of gold plating on the contacts, which provides a reliable connection between the socket and the memory module. This allows for faster data transfer, as well as a more reliable power supply.

Conclusion

The 10117865-252FSLF inline module socket from Harris Semiconductor is a low-profile, through-hole socket that is designed for use with a variety of memory modules. Its features make it suitable for data-intensive applications, as well as for use in space-constrained environments. Additionally, the socket provides a level of signal integrity that ensures maximum performance from the memory device. By understanding the application field and working principle of the 10117865-252FSLF, users can make informed decisions when selecting memory connectors for their systems.

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