10119101-10023LF

Memory Connectors - Inline Module Sockets

The 10119101-10023LF inline module sockets are designed to provide reliable and rugged connections from application boards to the external connectors. Commonly used in military/aerospace applications, these sockets are manufactured using a high-temperature, low-profile gold-plated contact surface to provide secure contact between multiple boards.

The socket is composed of two parts: a top part that connects to the application board and a bottom part that connects to the external connector. The top part of the socket consists of a male connector that mates with the female connector on the application board or other similar type of connection motherboard. The bottom part is connected to the board or external connector by a series of high-temperature solder joints. The solder joints provide strength and reliability against shock and vibration.

Applications

The 10119101-10023LF inline module sockets are commonly used in military/aerospace applications. These applications require high power voltage and current ratings to handle the heavy load of the application board and its external connectors. It also requires a secure connection between the board and the external connectors to ensure a high level of signal integrity.

The socket is also suitable for audio applications, instrumentation boards and a variety of other applications that require high power voltage and current ratings.

Working Principle

The 10119101-10023LF inline module sockets provide a secure and reliable connection between the application board and the external connectors. The high temperature, gold plated contact surface provides a highly reliable contact between the application and the external connectors. The socket does not require any soldering and is designed to withstand shock and vibration even in extreme conditions.

The socket also helps reduce the need for frequent board repairs by providing a secure and reliable connection between boards. This helps to ensure the reliability of the connection between boards and thus the reliability of the application board.

Conclusion

The 10119101-10023LF inline module sockets are designed to provide reliable and rugged connections from application boards to the external connectors. This type of socket is commonly used in military/aerospace applications and helps to reduce the need for frequent board repairs. The socket is composed of two parts, a top part that connects to the application board and a bottom part that connects to the external connector. The socket is designed with a high-temperature gold-plated contact surface to provide a secure contact between multiple boards.