Allicdata Part #: | MT29F256G08CKCABH2-10:A-ND |
Manufacturer Part#: |
MT29F256G08CKCABH2-10:A |
Price: | $ 0.00 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Micron Technology Inc. |
Short Description: | IC FLASH 256G PARALLEL 100MHZ |
More Detail: | FLASH - NAND Memory IC 256Gb (32G x 8) Parallel 10... |
DataSheet: | MT29F256G08CKCABH2-10:A Datasheet/PDF |
Quantity: | 1000 |
1 +: | 0.00000 |
Series: | -- |
Part Status: | Obsolete |
Memory Type: | Non-Volatile |
Memory Format: | FLASH |
Technology: | FLASH - NAND |
Memory Size: | 256Gb (32G x 8) |
Clock Frequency: | 100MHz |
Write Cycle Time - Word, Page: | -- |
Memory Interface: | Parallel |
Voltage - Supply: | 2.7 V ~ 3.6 V |
Operating Temperature: | 0°C ~ 70°C (TA) |
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Welcome to the world of memory technology! Memory is an integral part of computing, making it possible to store data and programs which can be retrieved and executed at a later time. For this purpose, memory comes in various shapes and forms, each with its own unique set of characteristics and property. Among them is the MT29F256G08CKCABH2-10:A, an integrated circuit memory device that is specifically designed for use in embedded systems. Let us take a closer look at this chip’s application field and working principle.
The MT29F256G08CKCABH2-10:A is a 256 Mbit (32 Megabytes) high-performance Flash memory device with Electronic/Hot Media registration. It is a 32 Megabyte Flash memory device that is well-suited for embedded systems. The chip comes with 2,048 Kbytes of Code Flash and 4,096 KBytes of Data Flash, and further supports the use of multiple different technologies for an extended memory capability which includes SLC (Single Level Cell), MLC (Multi Level Cell) and TLC (Triple Level Cell) for supporting a data cache memory.
Furthermore, the MT29F256G08CKCABH2-10:A is an ideal choice for embedded systems due to its versatile range of applications such as data storage, program execution, and storage media. The chip allows the user to quickly and easily access more than 32Mbytes of memory, making it a great choice for embedded devices with limited resources. Moreover, the MT29F256G08CKCABH2-10:A allows the user to select a variety of architectures, both full-featured and/or segmented, meaning that they can use the same architecture in multiple devices, while still providing the flexibility to configure and customize the memory solutions needed for each specific device. In addition, the chip features several advanced features such as Data Refresh, Signal Load and Unload, Address Bus Protect, and XOR, which helps enhance reliability for data stored within the memory.
The MT29F256G08CKCABH2-10:A also has a low power consumption compared to other similar Flash memory devices making it well-suited for battery-powered applications. It offers a wide range of operating voltages and various I/O configurations, making it compatible with various Embedded Processor cores. In addition, it also offers error correction and protection for the data stored in the chip, as well as additional protection against Random Access Vista attacks and data corruption.
Now let us take a look at the MT29F256G08CKCABH2-10:A’s working principle.
The MT29F256G08CKCABH2-10:A is based on the Non-volatile Memory technology. The chip stores data by using Electrically Programmable Read Only Memory cells, commonly known as PROMs. The memory cells retain the data even when the power is turned off, while the data can be access quickly and reliably with minimal power consumption. The chip also applies a data retention technique called Erase and Write, which allows a large amount of data to be stored in a small memory blocks.
The MT29F256G08CKCABH2-10:A further offers an advanced architecture for error detection and correction. Specifically, it uses Error Correction Codes (ECC) to verify the contents of the memory whenever it is accessed. Additionally, it provides additional protection for the data stored in the Flash memory chips with its built-in Flash PPU (Programmable Protection Unit).
In conclusion, the MT29F256G08CKCABH2-10:A is a competent choice for embedded systems applications due to its versatile range of applications, low power consumption, and advanced features such as error correction, data refresh, and address bus protection. Additionally, its use of non-volatile memory technology, along with its advanced architecture of error correction codes and the flash memory PPU, ensures reliability and security for data stored within the memory.
The specific data is subject to PDF, and the above content is for reference
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