MT29F256G08CMCABH2-10Z:A Allicdata Electronics
Allicdata Part #:

MT29F256G08CMCABH2-10Z:A-ND

Manufacturer Part#:

MT29F256G08CMCABH2-10Z:A

Price: $ 0.00
Product Category:

Integrated Circuits (ICs)

Manufacturer: Micron Technology Inc.
Short Description: IC FLASH 256G PARALLEL 100TBGA
More Detail: FLASH - NAND Memory IC 256Gb (32G x 8) Parallel 10...
DataSheet: MT29F256G08CMCABH2-10Z:A datasheetMT29F256G08CMCABH2-10Z:A Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Series: --
Packaging: Tube 
Part Status: Obsolete
Memory Type: Non-Volatile
Memory Format: FLASH
Technology: FLASH - NAND
Memory Size: 256Gb (32G x 8)
Clock Frequency: 100MHz
Write Cycle Time - Word, Page: --
Memory Interface: Parallel
Voltage - Supply: 2.7 V ~ 3.6 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TBGA
Supplier Device Package: 100-TBGA (12x18)
Description

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MT29F256G08CMCABH2-10Z is a kind of memory which belongs to NOR Flash family, it is a commodity type Flash with high density and low cost advantage. This type of memory module can be applied in fields such as boot code storage, firmware update and software code storage in a wide range of products.

MT29F256G08CMCABH2-10Z uses multilevel cell (MLC) technology to provide its 256 gigabyte (GB) capacity. The memory module is also known as an EEPROM and is used for words, modification and operations such as write and read. It is also often referred to as a reprogrammable memory due to its capability to store data in an EEPROM format and therefore be reprogrammed with new data when necessary.

The working principle of MT29F256G08CMCABH2-10Z is relatively simple. These devices are composed of many memory transistors, semiconductor devices, and nonvolatile memory structure. The transistors are connected together in 2N rows and 2N columns, forming a connection between the two devices. By connecting these transistors, the flash memory type MT29F256G08CMCABH2-10Z can read and write data to itself such as booting code, program, or data.

Through an array of NAND gates, each of which consists of a pair of transistors, the data bits and line paths are connected together. This enables the memory module to store more data in less space as compared to other memory types due to the different function of each NAND gate. When the data is read from the module a pulse of electric current is sent to the particular line address of the gate. During this process, electrons are released from the NAND gate, allowing for a lower threshold voltage for the signal to be read.

For writing and programming, a logic signal is sent from the host device to the memory module. Depending on the signal from the host, an access order is determined to either read or write data. For a write order, one of NAND gates would also be connected to the voltage on the line, allowing electrons to pass through the gate and allowing for data to be programmed in the module. For a read order, similarly, a signal is sent to the module through a certain line address, with the current allowing for the electrons to flow in the line, allowing for the data to be read.

MT29F256G08CMCABH2-10Z has a high read and write speed combined with a small amount of power consumption and an energy efficient design. It also has a very low power consumption and fast read/write access times. As discussed above, these memory modules are suitable for boot code storage, firmware update and software code storage, as well as in applications that require high data reliability, such as IoT and other fields where data management is important.

In conclusion, the MT29F256G08CMCABH2-10Z is a flexible, energy efficient, reliable and cost efficient memory module that can be used for a variety of applications from boot code storage, firmware update, and software code storage, to data management in IoT and other related fields.

The specific data is subject to PDF, and the above content is for reference

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