MT29RZ4B4DZZHGPL-18 W.80U

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The MT29RZ4B4DZZHGPL-18W.80U is an advanced type of memory technology, which is applied in various sectors for its powerful functions and sophisticated applications. It is a type of 3D memory which enables system architects to develop tighter and denser designs, due to its stacking capabilities.

The MT29RZ4B4DZZHGPL-18W.80U is a double data rate (DDR) 3D memory with a storage capacity of up to eight gigabytes. It uses 72-bit wide memory channels with a voltage interface of 1.35V. It is also compliant with the JEDEC specifications for DDR3 and is available in dual rank or quad rank configurations. This 3D memory is known for its low power consumption and high performance, making it suitable for the latest computer systems.

Workings of the MT29RZ4B4DZZHGPL-18W.80U memory includes the use of a Heat Spreader Layer (HSL) that is placed on top of the memory stack. The HSL helps to retain heat generated from the memory stack and reduce power consumption. At the same time, it also provides better thermal protection for the memory stack. A thermal interface material (TIM) is used to improve the thermal performance of the memory module, and a dielectric layer helps to eliminate electrical shorts between the layers.

The MT29RZ4B4DZZHGPL-18W.80U memory is applicable for a wide range of applications, including in data centers, embedded systems, super-computing and mobile computing systems. It is designed to support high bandwidths and increase communication speeds up to 2TB/s. It is especially important in mission-critical applications, where data must be processed quickly and accurately.

The MT29RZ4B4DZZHGPL-18W.80U memory is also used in storage solutions and graphics applications, as it is equipped with an Advanced Access Controller (AAC) which provides smoother and more efficient data throughputs. As with other DDR3 memory technologies, it uses a larger burst length and a higher bus clock frequency for better performance.

Overall, the MT29RZ4B4DZZHGPL-18W.80U is a powerful and versatile memory technology that is suitable for a wide range of applications. Its low power consumption and high-performance make it an ideal choice for systems that require fast memory access speeds. With its high-capacity and stackable design, it is the perfect choice for mission-critical and other resource-intensive applications.

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