Allicdata Part #: | RS1DHR3G-ND |
Manufacturer Part#: |
RS1DHR3G |
Price: | $ 0.04 |
Product Category: | Discrete Semiconductor Products |
Manufacturer: | Taiwan Semiconductor Corporation |
Short Description: | DIODE GEN PURP 200V 1A DO214AC |
More Detail: | Diode Standard 200V 1A Surface Mount DO-214AC (SMA... |
DataSheet: | RS1DHR3G Datasheet/PDF |
Quantity: | 1000 |
9000 +: | $ 0.03572 |
Series: | Automotive, AEC-Q101 |
Packaging: | Tape & Reel (TR) |
Part Status: | Active |
Diode Type: | Standard |
Voltage - DC Reverse (Vr) (Max): | 200V |
Current - Average Rectified (Io): | 1A |
Voltage - Forward (Vf) (Max) @ If: | 1.3V @ 1A |
Speed: | Fast Recovery = 200mA (Io) |
Reverse Recovery Time (trr): | 150ns |
Current - Reverse Leakage @ Vr: | 5µA @ 200V |
Capacitance @ Vr, F: | 10pF @ 4V, 1MHz |
Mounting Type: | Surface Mount |
Package / Case: | DO-214AC, SMA |
Supplier Device Package: | DO-214AC (SMA) |
Operating Temperature - Junction: | -55°C ~ 150°C |
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Introduction
RS1DHR3G is a silicon controlled rectifier (SCR) commonly used in power control, motor drive, and switch modulator applications. A SCR is composed of four PN junction layers and is designed as a bidirectional semiconductor switch. It consists of an anode and a cathode, with a third element referred to as the gate connected to a gate terminal.
The RS1DHR3G is an epitaxial planar gate-controlled thyristor with a gate and a cathode terminal. It is constructed from extremely thin wafer layers to achieve a high switching speed and low forward voltage drop, making it ideal for high power and pulse applications. In addition, it has a relatively high current gain, making it attractive for use in higher current applications such as motor drives.
Construction
The RS1DHR3G is constructed from a single, extremely thin wafer layer of intrinsic silicon and several other layers. At the center of the device is a P+ region surrounded by an N+ control electrode or "gate." On the opposite sides of the device are two N+ regions connected to a metal terminal, known as the anode terminal. Finally, a P+ contact region, known as the cathode, is connected to a metal terminal at the other side.
The P+ regions are created through the diffusion of impurities into the intrinsic silicon layer. This diffusion modifies the properties of the silicon by adding a positive charge, which affects the electrical properties of the silicon layer. These P+ regions act as voltage-controlled resistors that can be used to control the current flow between the anode and cathode terminals.
The N+ regions are also created by the diffusion of impurities into the intrinsic silicon layer. These regions act as current-controlled resistors, allowing for the control of the current between the anode and cathode terminals. In addition, this layer creates a physical barrier between the anode and cathode terminals, thus allowing for the bidirectional current flow that is characteristic of SCRs.
Working Principle
The RS1DHR3G is a gate-controlled component, which means that the current flow between the anode and cathode terminals is controlled by the voltage applied to the gate terminal. When the gate voltage is zero, the component is turned off or "nonconducting," meaning that the current flow between the anode and cathode terminals is effectively blocked. Conversely, when the gate voltage is above the "holding voltage," the component is turned on or "conducting," allowing for a relatively high current to flow between the anode and cathode terminals.
When the power starts to flow through thecomponent, the gate voltage is increased until it reaches the "holding voltage." At this point, the component is "latched," meaning that it remains conductive even if the gate voltage returns to zero. In order to turn off or "gate off" the component, the gate voltage must be increased beyond the "gating voltage," forcing the component to become nonconducting. The gate voltage must then be kept at a higher level to ensure that the component remains nonconducting.
Applications
Due to its combination of high switching speed, lowforward voltage drop, and relatively high current gain, the RS1DHR3G is suitable for a wide variety of power control, switching, and motor drive applications. It can be used in power supplies, motor controls, heating circuits, and for controlling the flow of current in batteries, solar cells, and photovoltaic systems. In addition, the RS1DHR3G can be used in microprocessor based applications, such as the control of digital output devices.
Conclusion
The RS1DHR3G is a high-performance,gate-controlled thyristor that is suitable for a wide range of high power and pulse applications. It is constructed from extremely thin wafer layers to achieve a high switching speed and low forward voltage drop, while its relatively high current gain makes it attractive for use in higher current applications such as motor drives. By applying the correct voltages to the gate terminal, the RS1DHR3G can be used to control the flow of current between the anode and cathode terminals, making it ideal for a range of power control, switching, and motor drive applications.
The specific data is subject to PDF, and the above content is for reference
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