Allicdata Part #: | S34ML01G200TFB003-ND |
Manufacturer Part#: |
S34ML01G200TFB003 |
Price: | $ 3.30 |
Product Category: | Integrated Circuits (ICs) |
Manufacturer: | Cypress Semiconductor Corp |
Short Description: | IC FLASH 1G PARALLEL 48TSOP I |
More Detail: | FLASH - NAND Memory IC 1Gb (128M x 8) Parallel 4... |
DataSheet: | S34ML01G200TFB003 Datasheet/PDF |
Quantity: | 1000 |
1000 +: | $ 2.99908 |
Specifications
Series: | ML-2 |
Packaging: | Tape & Reel (TR) |
Part Status: | Active |
Memory Type: | Non-Volatile |
Memory Format: | FLASH |
Technology: | FLASH - NAND |
Memory Size: | 1Gb (128M x 8) |
Write Cycle Time - Word, Page: | 25ns |
Memory Interface: | Parallel |
Voltage - Supply: | 2.7 V ~ 3.6 V |
Operating Temperature: | -40°C ~ 105°C (TA) |
Mounting Type: | Surface Mount |
Package / Case: | 48-TFSOP (0.724", 18.40mm Width) |
Supplier Device Package: | 48-TSOP I |
Description
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- S34ML01G200TFB003 Application Field:The S34ML01G200TFB003 memory device is an Single Level Cell (SLC) NAND Flash device designed for use with a wide range of applications. S34ML01G200TFB003 features a Serial Peripheral Interface (SPI) bus interface and is ideal for storing large and rapidly changing data files such as multimedia files. The device also includes error detection and correction (EDC) and bad block management (BBM) to guarantee data integrity, and ECC parity to ensure high reliability. The device is available in small form factors, and is pin-to-pin compatible with other NAND Flash devices.
- Working Principle of S34ML01G200TFB003:The working principle of the S34ML01G200TFB003 memory device is much like other NAND-based memory. A typical storage system built on NAND Flash devices consists of a NAND Flash memory, a controller, and corresponding software. The controller interfaces with NAND Flash memory and provides the correct timing for programming and erasing operations.The NAND Flash device performs a two-step operation: write/program and erase. First, when a write operation is triggered, electrons are injected into the Floating Gate (FG) of the cell. After a program operation, the appropriate Data In row and Bit line (BIT) voltages are applied to the memory cell, and the page is verified for data integrity.In the erase operation, the FG voltage is raised to a high voltage and electrons are removed from the FG. Subsequently, the programmed cells are discharged to “1”, where voltage is applied to the Data Out line to read the data.
- Conclusion:The S34ML01G200TFB003 memory device is an optimal choice for a wide range of applications due to its high-level of reliability and data integrity. Its performance is further increased by error detection and correction (EDC), bad block management (BBM), and ECC parity. The device offers Serial Peripheral Interface (SPI) bus interface, and is available in small form factors, and is pin-to-pin compatible with other NAND Flash devices.In addition, its working principle is based on the standard NAND Flash memory architecture. It includes an operation of write/program, where electrons are injected into the Floating Gate (FG) of the cell. The device also includes an operation of erase, where FG voltage is raised to a high voltage and electrons are removed from the FG.Overall, the S34ML01G200TFB003 memory device is a high-performance memory product, and is ideally suited for advanced storage applications.
The specific data is subject to PDF, and the above content is for reference
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