SI3932DV-T1-GE3 Allicdata Electronics
Allicdata Part #:

SI3932DV-T1-GE3TR-ND

Manufacturer Part#:

SI3932DV-T1-GE3

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: Vishay Siliconix
Short Description: MOSFET 2N-CH 30V 3.7A 6-TSOP
More Detail: Mosfet Array 2 N-Channel (Dual) 30V 3.7A 1.4W Surf...
DataSheet: SI3932DV-T1-GE3 datasheetSI3932DV-T1-GE3 Datasheet/PDF
Quantity: 1000
Stock 1000Can Ship Immediately
Specifications
Vgs(th) (Max) @ Id: 2.2V @ 250µA
Base Part Number: SI3932
Supplier Device Package: 6-TSOP
Package / Case: SOT-23-6 Thin, TSOT-23-6
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Power - Max: 1.4W
Input Capacitance (Ciss) (Max) @ Vds: 235pF @ 15V
Gate Charge (Qg) (Max) @ Vgs: 6nC @ 10V
Series: TrenchFET®
Rds On (Max) @ Id, Vgs: 58 mOhm @ 3.4A, 10V
Current - Continuous Drain (Id) @ 25°C: 3.7A
Drain to Source Voltage (Vdss): 30V
FET Feature: Logic Level Gate
FET Type: 2 N-Channel (Dual)
Part Status: Active
Packaging: Tape & Reel (TR) 
Description

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SI3932DV-T1-GE3 is a dual gate FET– array usually mounted on a surface-mount (SMT) package. This FET-array is designed as Radio Frequency (RF) device, which means that it can be used for a wide range of applications, including wireless communication, military-grade signals and so forth. Besides, it is one of the most reliable and powerful components that can work in industrial and consumer environments, providing the highest performance and negligible interference. The wide temperature range from -55°C to +125°C and the large power range from 1W to 10W ensure that SI3932DV-T1-GE3 can be applied in different conditions.

The SI3932DV-T1-GE3 components are strictly designed for telecommunications, based on high-performance trench BMOS technology. They have a high reliability due to the reflow soldering process, lead-frame package and HVIL technology. In conclusion, the SI3932DV-T1-GE3 provides the highest efficiency, small size and low profile, compared to other RF components.

The SI3932DV-T1-GE3 is an important component in different areas, such as power amplifier design and power switching. It is composed of two dual gate FETs, which offer the required RF flexibility to meet the requirements of the application. Moreover, its low leakage current, wide voltage range and high performance make it the preferred choice for advanced designs. In addition, the high speed switching characteristics make it suitable for wireless application.

The working principle of the SI3932DV-T1-GE3 is simple yet powerful. It operates by allowing current to flow through the two dual gates of the FETs. In order to control the flow of current, the gates are adjusted with the help of a bias voltage. As the voltage level changes, so does the current flowing through the gates, which in turn results in a change in the output of the device. This output can be used to obtain the desired signal strength, which is necessary for communication needs.

The SI3932DV-T1-GE3 can be used in a variety of RF applications, from wireless communication to high-performance critical signals. With its robustness and high frequency performance, it can be used in both harsh and mild environments, making it ideal for industrial, automotive, telecommunication and consumer applications. Moreover, its wide temperature range, high switching speed and excellent performance make it the ideal choice for advanced designs.

The specific data is subject to PDF, and the above content is for reference

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