SUP50020EL-GE3 Allicdata Electronics
Allicdata Part #:

SUP50020EL-GE3-ND

Manufacturer Part#:

SUP50020EL-GE3

Price: $ 0.00
Product Category:

Discrete Semiconductor Products

Manufacturer: Vishay Siliconix
Short Description: MOSFET N-CH 60V 120A TO220AB
More Detail: N-Channel 60V 120A (Tc) 375W (Tc) Through Hole TO-...
DataSheet: SUP50020EL-GE3 datasheetSUP50020EL-GE3 Datasheet/PDF
Quantity: 3817
Stock 3817Can Ship Immediately
Specifications
Series: TrenchFET®
Packaging: Bulk 
Part Status: Active
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Rds On (Max) @ Id, Vgs: 2.3 mOhm @ 30A, 10V
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs: 126nC @ 10V
Vgs (Max): ±20V
Input Capacitance (Ciss) (Max) @ Vds: 11113pF @ 30V
FET Feature: --
Power Dissipation (Max): 375W (Tc)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3
Description

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A field effect transistor (FET) is a three-terminal semiconductor device in which current is controlled by the electric field of a gate. SUP50020EL-GE3 is a single N-Channel enhancement mode field-effect transistor (FET) with very low Rdson. It is designed to be used in DC/DC converter, power management and power switching applications.

Features:

  • Very low Rdson
  • Low-voltage operation
  • Top-side gate for optimized routing
  • Integrated gate protection
  • Halogen-free, RoHS compliant

Applications:

  • DC-DC Converter
  • Power Management and Regulation
  • Power Switching

Working Principle:

The SUP50020EL-GE3 contains an N-Channel Metal-Oxide Silicon (MOS) gate field-effect transistor, providing very low on-resistance and offset. The device also has an integrated gate protection circuit, which prevents gate to source over-voltage in applications with large transients. The top-side gate provides optimized routing while an exposed backside pad helps heat dissipation.

The device utilizes an enhancement-mode gate structure with an internal drain-source diode. When a positive voltage is applied to the gate relative to the source, the channel is created between the drain and the source, with the channel width and length determining the RDSon of the device. Current flows from the drain to the source with an effective RDSon determined by the gate, source, drain and channel characteristics.

The RDSon of the device increases with channel temperature, and is low enough to allow for good thermal dissipation. The device is able to switch at a much higher frequency compared to bipolar equivalents, and dissipates very low switching losses. The device is also well suited for ultra-low standby power applications, because of its low leakage current.

The integrated gate protection circuit provides robust protection against over-voltage transients and keeps the gate at a safe voltage level. This protection can ensure that the device is not damaged during transient conditions. The top-side gate is optimized to provide better routing and the exposed backside pad helps dissipate heat more efficiently.

The specific data is subject to PDF, and the above content is for reference

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