AER21-21-12CB/A01

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Thermal management is critical for the effective performance of most electronics. Heat generated during operation must be dissipated in order to keep components from becoming too hot and suffering short-life or permanent failure. AER21-21-12CB/A01 is a thermal solution widely used in dissipation of heat generated in the vicinity of a heat source.

AER21-21-12CB/A01 is a large, extruded and pinned aluminum heat sink with a 21-pin pinfin array and up to 21-pin extended through-board layout. The plate-fin structure reduces the thermal resistance while improving the heat transfer performance. This type of heat sink has many advantages, such as its simple assembly, good thermal energy dissipation, and wide application fields.

The primary applications of AER21-21-12CB/A01 include the cooling of microprocessors, power semiconductor circuits, LEDs, high-power resistors and the high-power electronic components. It can also be used in applications for battery power supply, telecommunications, medical instruments, industrial equipment, and consumer electronics.

AER21-21-12CB/A01 consists of certain components, such as extruded heat sink, pins, mounting brackets, thermal paste, and screws. It works by extracting the heat in the device to the air by conduction. The heat generated by the device is picked up and dissipated by the heat sink, reducing its temperature and allowing it to perform efficiently. The heat sink acts as a radiating element, providing an ideal air flow path from the device interior to the outside environment.

The AER21-21-12CB/A01 thermal solution also features the efficient cooling of the heat source by utilizing the natural air convection around the device. This is accomplished by using the convection principle, which moves the hot air above the device towards the cold air below, resulting in a circulation and better heat transfer. This argument is even more effective when several fins are added, which enhances the transfer of thermal energy.

The working principle of AER21-21-12CB/A01 is based on convection, which is the transfer of thermal energy in fluids. The heat generated by the device is picked up by the heat sink and then convected to the atmosphere. To increase the heat transfer rate, fin extensions are used to increase the surface area and to allow air to flow freely. This increase in surface area helps to reduce thermal resistance and improve heat dissipation performance.

In summary, AER21-21-12CB/A01 is an excellent thermal solution for dissipating heat generated in the vicinity of a heat source. The heat sink comes with a 21-pin pin fin array with up to 21-pin extended through-board layout, providing excellent thermal energy dissipation. It is suitable for cooling of microprocessors, power semiconductor circuits, LEDs, high-power resistors and high-power electronic components, and is widely used in applications for battery power supply, telecommunications, medical instruments, industrial equipment, and consumer electronics.

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