AER21-21-33CB/A01 Allicdata Electronics
Allicdata Part #:

AER21-21-33CB/A01-ND

Manufacturer Part#:

AER21-21-33CB/A01

Price: $ 3.92
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER21-21-33CB/A01 datasheetAER21-21-33CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 3.55679
Stock 1000Can Ship Immediately
$ 3.92
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 0.811" (20.60mm)
Width: 0.811" (20.60mm)
Diameter: --
Height Off Base (Height of Fin): 1.283" (32.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.42°C/W @ 200 LFM
Thermal Resistance @ Natural: 12.20°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The AER21-21-33CB/A01 is a thermally-managed heat sink designed to be used in a wide range of applications. This type of heat sink is designed to efficiently transfer heat away from components and dissipate it into the surrounding environment. The heat sink uses a combination of thermal material, advanced fin construction, and a base design to facilitate heat dissipation.The construction of the AER21-21-33CB/A01 is an integral part of its performance. The unit is manufactured out of die-cast aluminum and features an anodized black finish that is both attractive and functional. The base design sandwiches between two layers of extruded aluminum fins, providing excellent thermal and structural stability. The extruded fin structure also gives the heat sink extremely efficient heat transfer capabilities. The interior of the extruded fins is made up of a series of louvers that form a series of channels and help promote efficient and effective heat dissipation.The unit is designed to be used in tight-spaced applications, such as in small computer systems or prototype devices. The AER21-21-33CB/A01 is also designed for use in high-power applications and devices such as amplifiers, high-performance CPUs, or GPUs.In terms of operation, the AER21-21-33CB/A01 is designed to dissipate heat efficiently via convection. This occurs when the natural flow of air allows the thermal energy to be transferred from the device into the environment. The convection process is aided by forced air. This is accomplished by using fans to blow air through the heat sink. This process not only helps to dissipate the heat away from the device but also helps to keep the device components within acceptable operating temperature ranges.In addition to its efficient thermal conducvitiy, the AER21-21-33CB/A01 also provides physical protection to the device components. The anodized black finish provides a protective layer against minor chips and other physical damage. Additionally, the die-cast aluminum construction is designed to provide additional vibration dampening, further prolonging the lifespan of the device.Overall, the AER21-21-33CB/A01 is an excellent thermal management solution that can be used in a variety of applications. Its efficient convection and insulation capabilities ensure that device temperatures remain within acceptable ranges, allowing devices to operate at peak performance levels. The unit is also relatively easy to install, making it an ideal solution for use in tight spaces, or in situations where space is at a premium.

The specific data is subject to PDF, and the above content is for reference

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