AER29-29-23CB/A01 Allicdata Electronics
Allicdata Part #:

AER29-29-23CB/A01-ND

Manufacturer Part#:

AER29-29-23CB/A01

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER29-29-23CB/A01 datasheetAER29-29-23CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 3.89258
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 1.126" (28.60mm)
Width: 1.126" (28.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.890" (22.61mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.12°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.78°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

AER29-29-23CB/A01 is a kind of thermal-heat sinks, which mainly work for heat dissipation, thermal management and thermal control. Generally, AER29-29-23CB/A01 is applicable for electronic devices, which require high power level and those components that have high emission heat. Thermal-heat sinks also provide the optimized solutions for LED applications.

AER29-29-23CB/A01 can be divided into two parts, fin stack and base plate. It has a wide variety of sizes which can fulfill the requirements from different applications. The fin stack consists of many folded fins with aluminum materials and these fins can be connected with straight-fin or curved fin. Meanwhile, the base plate makes of ultimate material that possessed higher conductivity and further, the base plate contains heat pipes to enhance the heat transfer.

The working principle of a thermal-heat sink is to move the heat away from the heat source and separate them effectively with an appropriate temperature difference. When thermal-heat sinks are working, the temperature of the heat generator will drop down and the heat obtained will be transferred into air outside or to the other areas. Furthermore, the heat will be dissipated by the fin of the sink and the hot air will flow away from the device eventually.

When the heat generation occurs, the thermal-heat sink will conduct the heat from the heat source and these heat are then become the hot area on the base plate. Then, the heat can flow working from the hot area towards the fins. On the other side, the bas plate contains heat pipes. These heat pipes inside the base plate will draw out the heat and transfer them into the fin. Thus, the heat is conducted away from the base plate into the fins. Eventually, the heat dissipate out from the fin stack when the hot air being released.

The performance of the thermal-heat sink mainly depends on the surface area of the fins and the air current in the environment. A larger surface area will increase the dissipation area and draws the bigger heat sink current. On the other hand, air current can be enhanced by the fan which guarantees the environment can draw the heat away from the fin faster.

Working with the optimized solution, AER29-29-23CB/A01 thermal-heat sink can provide a most efficient heat dissipation, thermal management and thermal control. It has been widely used in the applications of high power level and high temperature emission components. Therefore, AER29-29-23CB/A01 can be seen as a most useful product in the field of Thermal-heat sinks.

The specific data is subject to PDF, and the above content is for reference

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