AER25-25-28CB/A01 Allicdata Electronics

AER25-25-28CB/A01 Fans, Thermal Management

Allicdata Part #:

AER25-25-28CB/A01-ND

Manufacturer Part#:

AER25-25-28CB/A01

Price: $ 4.27
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER25-25-28CB/A01 datasheetAER25-25-28CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 3.84457
Stock 1000Can Ship Immediately
$ 4.27
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 0.969" (24.61mm)
Width: 0.969" (24.61mm)
Diameter: --
Height Off Base (Height of Fin): 1.087" (27.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.92°C/W @ 200 LFM
Thermal Resistance @ Natural: 10.58°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

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Thermal management is a broad field which encompasses a range of technologies and products, from coolers and dissipaters to heat exchangers and heat sinks. Heat sinks in particular are extremely important components of a modern consumer electronics products, as they help to dissipate and regulate temperatures across devices and components. One such device is the AER25-25-28CB/A01 heat sink, a product designed to meet the demands of the most demanding applications. In this article, we discuss the application field and working principle of the AER25-25-28CB/A01 heat sink.

The AER25-25-28CB/A01 heat sink is a thermal management product for industrial and consumer electronic devices which offers high performance thermal regulation and dissipation. It is an extremely accurate thermal solution and is capable of greatly reducing temperatures in devices, components and systems. The device boasts a very high Fill Factor, which is the percentage of the base area that is covered by the fins, as well as a low thermal resistance, meaning that the heat sink is able to rapidly and efficiently dissipate thermal energy.

One of the most important features of the AER25-25-28CB/A01 heat sink is its low profile design, which allows it to be used in slim devices such as laptops, tablets and smartphones without adding substantial thickness. It also performs well in high density applications, such as densely packed memory modules, which are often found in servers and rack-mounted equipment. The heat sink also features an advanced aluminum core with a downwardly angled fin array, which helps to precisely direct heated air away from the device or component which it is protecting.

The AER25-25-28CB/A01 operates using a Peltier effect. This is a thermoelectric cooling technology, which uses the Seebeck effect to generate electricity when two dissimilar metals are placed in contact. This electricity then drives a Peltier cooler, which moves heat from one side of a device to the other, thus cooling the device or component. The AER25-25-28CB/A01 heat sink is designed to take full advantage of the Peltier principle and is capable of cooling devices to an impressive -25°C. This ensures that any device employing the AER25-25-28CB/A01 is able to operate within a safe temperature range.

The AER25-25-28CB/A01 heat sink has a wide range of applications in both consumer and industrial electronics. It is perfect for use in small, slim device such as tablets and laptops, as well as for densely-packed components such as high-end servers. It is also an excellent choice for electric vehicle applications, such as motor controllers, battery packs and powertrain components, as well as for aerospace applications, such as navigation and avionics equipment and thermographic cameras. The device is also ideal for medical applications, such as MRI and PET scanners, as well as for cooling lamps, LEDs and laser modules.

In conclusion, the AER25-25-28CB/A01 heat sink is an ideal product for any application requiring accurate thermal regulation and dissipation. Utilizing the Peltier effect, the heat sink is able to cool devices and components to -25°C, ensuring that any device using it operates within the safe temperature range. The product is also designed to fit even the slimmest of devices and is capable of cooling densely-packed components with ease. With its wide range of applications, from consumer electronics to medical and aerospace devices, the AER25-25-28CB/A01 is an invaluable product for any thermal management application.

The specific data is subject to PDF, and the above content is for reference

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