AER21-21-21CB/A01

Series:	AER
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Fins
Length:	0.811" (20.60mm)
Width:	0.811" (20.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.811" (20.60mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.42°C/W @ 200 LFM
Thermal Resistance @ Natural:	14.10°C/W
Material:	Aluminum Alloy
Material Finish:	Black Anodized

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The AER21-21-21CB/A01 thermal system is an important solution in the field of heat sinks. It has been proven to effectively dissipate heat from electronic components, thus prolonging the lifespan of the components without the need to replace them. The system works by using an advanced thermal material to create a thermal bridge between a heat source and a heat sink. Heat is then efficiently transferred from the heat source to the heat sink, thus preventing the electronic components from overheating.The AER21-21-21CB/A01 system is comprised of a base plate, a heat spreader, and two thermal channels. The base plate is made from anodized aluminum and provides a base for the remaining components. It also has a series of holes which helps in the installation of the thermal channels. The thermal channels are made from thermally conductive materials, such as copper or aluminum, and are designed to conduct heat away from the heat source to the heat sink.The heat spreader is made from a thermal material such as graphite or silicone foam. This material is designed to absorb any excess heat from the components, thus allowing the system to function even during higher temperature changes. The material also helps to evenly spread the heat over a larger area, resulting in a more efficient transfer of heat away from the components.The AER21-21-21CB/A01 system is ideal for a variety of electronic components, such as circuit boards, CPUs, and memory components. It is also well suited for applications in the aerospace, automotive, and semiconductor industry. It is a reliable and efficient heat dissipating solution, and can be customized for any application.The AER21-21-21CB/A01 system is easy to install and use, and its components are designed to be resistant to corrosion. It has undergone rigorous testing and is certified for use with a variety of components. The system is also designed to be compatible with a variety of operating systems, making it an excellent choice for any application.Overall, the AER21-21-21CB/A01 thermal system is a reliable and efficient way to dissipate heat from electronic components. Its components are designed to be corrosion resistant and are compatible with a variety of operating systems. The system is easy to install and use, and its thermal spreader ensures an efficient transfer of heat away from the components. It is ideal for a variety of applications in the aerospace, automotive, and semiconductor industry.

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