AER29-29-18CB/A01 Allicdata Electronics
Allicdata Part #:

AER29-29-18CB/A01-ND

Manufacturer Part#:

AER29-29-18CB/A01

Price: $ 4.00
Product Category:

Fans, Thermal Management

Manufacturer: CTS Thermal Management Products
Short Description: HEATSINK FORGED BLK ANO TOP MNT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: AER29-29-18CB/A01 datasheetAER29-29-18CB/A01 Datasheet/PDF
Quantity: 1000
100 +: $ 3.63743
Stock 1000Can Ship Immediately
$ 4
Specifications
Series: AER
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Fins
Length: 1.126" (28.60mm)
Width: 1.126" (28.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.693" (17.60mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.62°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.48°C/W
Material: Aluminum Alloy
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal solutions for electronic devices, especially those with high heat output, are essential for proper operation. Heat sinks are a popular and accepted method of dissipating the heat generated by components, and the AER29-29-18CB/A01 is a top-of-the-line heat sink for such applications. This article will discuss the application field and working principle of the AER29-29-18CB/A01.

The AER29-29-18CB/A01 is designed for use in extreme temperature conditions, such as inside electrical enclosures or in high-powered amplifiers. It is built with a large fin area and a four-piece plate construction that allows for maximum heat transfer from the components to the fins. The AER29-29-18CB/A01 is made from aluminum, which is highly conductive and provides excellent heat dissipation. The mounting brackets are powder-coated, and the components are soldered for use in damp or corrosive environments.

The primary purpose of a heat sink is to reduce the temperature of a component by dissipating heat away from it. The AER29-29-18CB/A01 uses an air-flow design to transfer the heat away from the components through the fins of the heat sink. The four-piece plate construction allows for maximum air flow and heat transfer, while the powder-coated brackets help to quickly transfer the heat to the fins. The combination of the large fin area and the powder-coated brackets helps dissipate the heat away from the component much faster than a traditional heat sink.

In addition to dissipating the heat, the AER29-29-18CB/A01 also helps protect the components from temperature fluctuations. The large fin area helps to spread the heat across the fins, preventing sudden spikes in temperature caused by concentrated heat. The powder-coated brackets also help to reduce temperature spikes by providing insulation from the elements. The combination of these features helps to protect the components from thermal shock and related damage.

The AER29-29-18CB/A01 is able to provide superior thermal performance in extreme temperature conditions. It is designed for use in applications where other traditional heat sinks fail due to their inability to dissipate heat quickly enough. The four-piece plate design and powder-coated brackets help to quickly and easily transfer heat away from the components, protecting them from thermal shock and damage. Overall, the AER29-29-18CB/A01 is an ideal thermal solution for many types of electronic devices.

The specific data is subject to PDF, and the above content is for reference

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